The purpose of this study was to evaluate the bonding interface and bonding strength of electroformed coping when cast joining was used with a multi-purpose alloy. The multi-purpose alloy was cast at a mold temperature of 700, 750 or 800 degrees C. A high noble alloy tab was also soldered onto an electroformed coping as a control. Sectioned surfaces of cast joining and soldered specimens were observed using a scanning electron microscope and analyzed using an electron probe micro analyzer. Shear bonding strength of specimens cast at 750 degrees C and that of soldered specimens were determined. The edge of the cast joining alloy was round, but this improved as temperature increased. Diffusion of elements from the cast joining alloy and electroformed coping was detected at the interface, which contributed to a significantly higher bonding strength in the cast joining specimen than in the soldered specimen. These results suggested that the cast joining could be potentially employed for electroformed copings.