Nanostructured copper interfaces for enhanced boiling

Small. 2008 Aug;4(8):1084-8. doi: 10.1002/smll.200700991.

Authors

Chen Li¹, Zuankai Wang, Pei-I Wang, Yoav Peles, Nikhil Koratkar, G P Peterson

Affiliation

¹ Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309, USA.

PMID: 18570277
DOI: 10.1002/smll.200700991

No abstract available

Publication types

Research Support, U.S. Gov't, Non-P.H.S.

MeSH terms

Copper*
Gases
Hot Temperature*
Microscopy, Electron, Scanning
Nanostructures* / ultrastructure
Nanotubes* / ultrastructure
Phase Transition
Surface Properties

Substances

Gases
Copper