Hole free phase plate tomography for materials sciences samples

Micron. 2019 Jan:116:54-60. doi: 10.1016/j.micron.2018.09.005. Epub 2018 Sep 7.

Abstract

We report, for the first time, the three dimensional reconstruction (3D) of a transistor from a microprocessor chip and roughness of molecular electronic junction obtained by electron tomography with Hole Free Phase Plate (HFPP) imaging. The HFPP appears to enhance contrast between inorganic materials and also increase the visibility of interfaces between different materials. We demonstrate that the degree of enhancement varies depending on material and thickness of the samples using experimental and simulation data.

Keywords: Electron tomography; Hole free phase plate (HFPP); Interface roughness; Molecular electronic junction; Transistor imaging; Transmission electron microscope (TEM).