Cui P - Search Results

1

Fabrication of transmission phase gratings on porous anodic alumina.

Wang B, Zhang XP, Song WJ, Cui P, Zhang Y, Fei GT. Wang B, et al. Among authors: cui p. Opt Lett. 2010 Mar 1;35(5):727-9. doi: 10.1364/OL.35.000727. Opt Lett. 2010. PMID: 20195333

2

The fabrication and thermal expansion properties of 4H-Ag nanowire arrays in porous anodic alumina templates.

Zhou Y, Fei GT, Cui P, Wu B, Wang B, Zhang LD. Zhou Y, et al. Among authors: cui p. Nanotechnology. 2008 Jul 16;19(28):285711. doi: 10.1088/0957-4484/19/28/285711. Epub 2008 Jun 3. Nanotechnology. 2008. PMID: 21828745

3

Porous anodic alumina with low refractive index for broadband graded-index antireflection coatings.

Chen J, Wang B, Yang Y, Shi Y, Xu G, Cui P. Chen J, et al. Among authors: cui p. Appl Opt. 2012 Oct 1;51(28):6839-43. doi: 10.1364/AO.51.006839. Appl Opt. 2012. PMID: 23033100

4

Dynamic "Scanning-Mode" Meniscus Confined Electrodepositing and Micropatterning of Individually Addressable Ultraconductive Copper Line Arrays.

Lei Y, Zhang X, Xu D, Yu M, Yi Z, Li Z, Sun A, Xu G, Cui P, Guo J. Lei Y, et al. Among authors: cui p. J Phys Chem Lett. 2018 May 3;9(9):2380-2387. doi: 10.1021/acs.jpclett.8b00636. Epub 2018 Apr 24. J Phys Chem Lett. 2018. PMID: 29682964

5

Fabrication of uniform core-shell structural calcium and titanium precipitation particles and enhanced electrorheological activities.

Cheng Y, Liu X, Guo J, Liu F, Li Z, Xu G, Cui P. Cheng Y, et al. Among authors: cui p. Nanotechnology. 2009 Feb 4;20(5):055604. doi: 10.1088/0957-4484/20/5/055604. Epub 2009 Jan 12. Nanotechnology. 2009. PMID: 19417351

6

Size-controllable synthesis of monodispersed colloidal silica nanoparticles via hydrolysis of elemental silicon.

Guo J, Liu X, Cheng Y, Li Y, Xu G, Cui P. Guo J, et al. Among authors: cui p. J Colloid Interface Sci. 2008 Oct 1;326(1):138-42. doi: 10.1016/j.jcis.2008.07.020. Epub 2008 Jul 17. J Colloid Interface Sci. 2008. PMID: 18674771

7

The influence of high dielectric constant core on the activity of core-shell structure electrorheological fluid.

Wu J, Xu G, Cheng Y, Liu F, Guo J, Cui P. Wu J, et al. Among authors: cui p. J Colloid Interface Sci. 2012 Jul 15;378(1):36-43. doi: 10.1016/j.jcis.2012.04.044. Epub 2012 Apr 25. J Colloid Interface Sci. 2012. PMID: 22579514

8

Vertical, capacitive microelectromechanical switches produced via direct writing of copper wires.

Yi Z, Guo J, Chen Y, Zhang H, Zhang S, Xu G, Yu M, Cui P. Yi Z, et al. Among authors: cui p. Microsyst Nanoeng. 2016 Apr 25;2:16010. doi: 10.1038/micronano.2016.10. eCollection 2016. Microsyst Nanoeng. 2016. PMID: 31057818 Free PMC article.

9

Ultralow flexural properties of copper microhelices fabricated via electrodeposition-based three-dimensional direct-writing technology.

Yi Z, Lei Y, Zhang X, Chen Y, Guo J, Xu G, Yu MF, Cui P. Yi Z, et al. Among authors: cui p. Nanoscale. 2017 Aug 31;9(34):12524-12532. doi: 10.1039/c7nr03803h. Nanoscale. 2017. PMID: 28819668

10

Super toughened blends of poly(lactic acid) and poly(butylene adipate-co-terephthalate) injection-molded foams via enhancing interfacial compatibility and cellular structure.

Wu M, Ren Q, Zhu X, Li W, Luo H, Wu F, Wang L, Zheng W, Cui P, Yi X. Wu M, et al. Among authors: cui p. Int J Biol Macromol. 2023 Aug 1;245:125490. doi: 10.1016/j.ijbiomac.2023.125490. Epub 2023 Jun 20. Int J Biol Macromol. 2023. PMID: 37348589

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