Zhan T - Search Results

1

Effect of Thermal Boundary Resistance between the Interconnect Metal and Dielectric Interlayer on Temperature Increase of Interconnects in Deeply Scaled VLSI.

Zhan T, Oda K, Ma S, Tomita M, Jin Z, Takezawa H, Mesaki K, Wu YJ, Xu Y, Matsukawa T, Matsuki T, Watanabe T. Zhan T, et al. ACS Appl Mater Interfaces. 2020 May 13;12(19):22347-22356. doi: 10.1021/acsami.0c03010. Epub 2020 Apr 30. ACS Appl Mater Interfaces. 2020. PMID: 32315529

2

Prediction of thermal boundary resistance by the machine learning method.

Zhan T, Fang L, Xu Y. Zhan T, et al. Sci Rep. 2017 Aug 2;7(1):7109. doi: 10.1038/s41598-017-07150-7. Sci Rep. 2017. PMID: 28769034 Free PMC article.

3

Miniaturized planar Si-nanowire micro-thermoelectric generator using exuded thermal field for power generation.

Zhan T, Yamato R, Hashimoto S, Tomita M, Oba S, Himeda Y, Mesaki K, Takezawa H, Yokogawa R, Xu Y, Matsukawa T, Ogura A, Kamakura Y, Watanabe T. Zhan T, et al. Sci Technol Adv Mater. 2018 May 24;19(1):443-453. doi: 10.1080/14686996.2018.1460177. eCollection 2018. Sci Technol Adv Mater. 2018. PMID: 29868148 Free PMC article.

4

Physical and chemical descriptors for predicting interfacial thermal resistance.

Wu YJ, Zhan T, Hou Z, Fang L, Xu Y. Wu YJ, et al. Among authors: zhan t. Sci Data. 2020 Feb 3;7(1):36. doi: 10.1038/s41597-020-0373-2. Sci Data. 2020. PMID: 32015329 Free PMC article.

5

Author Correction: Physical and chemical descriptors for predicting interfacial thermal resistance.

Wu YJ, Zhan T, Hou Z, Fang L, Xu Y. Wu YJ, et al. Among authors: zhan t. Sci Data. 2020 Feb 17;7(1):61. doi: 10.1038/s41597-020-0405-y. Sci Data. 2020. PMID: 32066729 Free PMC article.

6

Effect of the Thermal Boundary Resistance in Metal/Dielectric Thermally Conductive Layers on Power Generation of Silicon Nanowire Microthermoelectric Generators.

Zhan T, Ma S, Jin Z, Takezawa H, Mesaki K, Tomita M, Wu YJ, Xu Y, Matsukawa T, Matsuki T, Watanabe T. Zhan T, et al. ACS Appl Mater Interfaces. 2020 Jul 29;12(30):34441-34450. doi: 10.1021/acsami.0c09253. Epub 2020 Jul 15. ACS Appl Mater Interfaces. 2020. PMID: 32635712

7

Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits.

Zhan T, Sahara K, Takeuchi H, Yokogawa R, Oda K, Jin Z, Deng S, Tomita M, Wu YJ, Xu Y, Matsuki T, Wang H, Song M, Guan S, Ogura A, Watanabe T. Zhan T, et al. ACS Appl Mater Interfaces. 2022 Feb 9;14(5):7392-7404. doi: 10.1021/acsami.1c20366. Epub 2022 Jan 31. ACS Appl Mater Interfaces. 2022. PMID: 35099170

8

Effects of Thermal Boundary Resistance on Thermal Management of Gallium-Nitride-Based Semiconductor Devices: A Review.

Zhan T, Xu M, Cao Z, Zheng C, Kurita H, Narita F, Wu YJ, Xu Y, Wang H, Song M, Wang W, Zhou Y, Liu X, Shi Y, Jia Y, Guan S, Hanajiri T, Maekawa T, Okino A, Watanabe T. Zhan T, et al. Micromachines (Basel). 2023 Nov 8;14(11):2076. doi: 10.3390/mi14112076. Micromachines (Basel). 2023. PMID: 38004933 Free PMC article. Review.

9

Experimental Study on Solidification Characteristics of Sessile Urine Droplets on a Horizontal Cold Plate Surface under Natural Convection.

Dang Q, Song M, Dang C, Zhan T, Zhang L. Dang Q, et al. Among authors: zhan t. Langmuir. 2022 Jun 28;38(25):7846-7857. doi: 10.1021/acs.langmuir.2c01154. Epub 2022 Jun 13. Langmuir. 2022. PMID: 35696680

10

Direct visualization of ultrasonic power distribution using mechanoluminescent film.

Zhan T, Xu CN, Fukuda O, Yamada H, Li C. Zhan T, et al. Ultrason Sonochem. 2011 Jan;18(1):436-9. doi: 10.1016/j.ultsonch.2010.07.017. Epub 2010 Jul 30. Ultrason Sonochem. 2011. PMID: 20727813 Free article.

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