Carbon-Encapsulated Copper Sulfide Leading to Enhanced Thermoelectric Properties.
Chen X, Zhang H, Zhao Y, Liu WD, Dai W, Wu T, Lu X, Wu C, Luo W, Fan Y, Wang L, Jiang W, Chen ZG, Yang J.
Chen X, et al. Among authors: wu t, wu c.
ACS Appl Mater Interfaces. 2019 Jun 26;11(25):22457-22463. doi: 10.1021/acsami.9b06212. Epub 2019 Jun 13.
ACS Appl Mater Interfaces. 2019.
PMID: 31194506