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Effect of Thermal Boundary Resistance between the Interconnect Metal and Dielectric Interlayer on Temperature Increase of Interconnects in Deeply Scaled VLSI.
Zhan T, Oda K, Ma S, Tomita M, Jin Z, Takezawa H, Mesaki K, Wu YJ, Xu Y, Matsukawa T, Matsuki T, Watanabe T. Zhan T, et al. Among authors: wu yj. ACS Appl Mater Interfaces. 2020 May 13;12(19):22347-22356. doi: 10.1021/acsami.0c03010. Epub 2020 Apr 30. ACS Appl Mater Interfaces. 2020. PMID: 32315529
Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits.
Zhan T, Sahara K, Takeuchi H, Yokogawa R, Oda K, Jin Z, Deng S, Tomita M, Wu YJ, Xu Y, Matsuki T, Wang H, Song M, Guan S, Ogura A, Watanabe T. Zhan T, et al. Among authors: wu yj. ACS Appl Mater Interfaces. 2022 Feb 9;14(5):7392-7404. doi: 10.1021/acsami.1c20366. Epub 2022 Jan 31. ACS Appl Mater Interfaces. 2022. PMID: 35099170
A comprehensive data network for data-driven study of battery materials.
Xu Y, Wu YJ, Li H, Fang L, Hayashi S, Oishi A, Shimizu N, Caputo R, Villars P. Xu Y, et al. Among authors: wu yj. Sci Technol Adv Mater. 2024 Sep 11;25(1):2403328. doi: 10.1080/14686996.2024.2403328. eCollection 2024. Sci Technol Adv Mater. 2024. PMID: 39559529 Free PMC article.
Effects of Thermal Boundary Resistance on Thermal Management of Gallium-Nitride-Based Semiconductor Devices: A Review.
Zhan T, Xu M, Cao Z, Zheng C, Kurita H, Narita F, Wu YJ, Xu Y, Wang H, Song M, Wang W, Zhou Y, Liu X, Shi Y, Jia Y, Guan S, Hanajiri T, Maekawa T, Okino A, Watanabe T. Zhan T, et al. Among authors: wu yj. Micromachines (Basel). 2023 Nov 8;14(11):2076. doi: 10.3390/mi14112076. Micromachines (Basel). 2023. PMID: 38004933 Free PMC article. Review.
1,925 results