Deployable electronics with enhanced fatigue resistance for crumpling and tension.
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Hong I, et al. Among authors: an h.
Sci Adv. 2025 Jan 24;11(4):eadr3654. doi: 10.1126/sciadv.adr3654. Epub 2025 Jan 22.
Sci Adv. 2025.
PMID: 39841835
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