Semiconductor Engineering’s Post

Special Report: Intel Vs. Samsung Vs. TSMC Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish. By Ed Sperling. https://lnkd.in/gYhzuy6s #semiconductor #semiconductormanufacturing #EMIB Intel Corporation Samsung Semiconductor TSMC Intel Foundry Lalitha Immaneni Rene Haas Arm #chiplets TAEJOONG SONG #backsidepowerdelivery #CFETs #HBM #UCIe

Semiconductor Engineering's latest Test, Measurement and Analytics Newsletter: https://lnkd.in/gm-A_Wpv #semiconductor #semiconductortest #semiconductormanufacturing #advancedpackaging #digitaltwins #automotivetest PDF Solutions Nordson TEST & INSPECTION proteanTecsAdvantest Synopsys Inc Onto Innovation Bruker Nano Surfaces & Metrology DR YIELD Teradyne NI (National Instruments)

Solving battery management, utilization, charging and vehicle-to-grid issues is essential to boosting EV adoption. By Ann Mutschler. https://lnkd.in/gVymtwVW #EVs #ElectricVehicles #batteries #batterycharging Puneet Sinha Kumar Srinivasan Cadence Design Systems Siemens Digital Industries Software Jayson Bethurem Flex Logix Technologies, Inc. Wayne Lyons AMD #batterymanagement #GaN #SiC Intel Corporation Gary Martz

Latest news: Softbank’s acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships and more.. https://lnkd.in/eDHh6RiG #semiconductor #semiconductormanufacturing #EDA #advancedpackaging Onto Innovation U.S. Department of Commerce SEMI Applied Materials SoftBank Group Corp. CMC Microsystems ASE Global ISE Labs PhotonDelta Samsung Electronics MELEXIS SOITEC United Microelectronics Corporation (UMC) Natcast.org AMD Accenture UC San Diego Ansys Infineon Technologies Advantest Siemens Digital Industries Software CEA-Leti @

X-Ray Inspection Becoming Essential In Advanced Packaging https://lnkd.in/dZSa6kSx Improvements in speed and precision have transformed a research tool for studying defects in chips into an industry workhorse. By Gregory Haley. #semiconductor #advancedpackaging #inspection #xrayinspection #semiconductormanufacturing #HBM Daniel Chen Bruker Nano Surfaces & Metrology Brad Perkins Nordson Corporation Fred Duewer Adi Shulner PDF Solutions Michael Yu Keith Schaub Advantest Mark Kahwati Teradyne #chiplets

91 startups raise $2.6 billion, with big rounds for AI chips. By Jesse Allen. AI drew more investors to the chip industry in Q2. Four AI-focused chip startups receiving rounds of more than $100 million, targeting data center ASICs for transformers, highly flexible platforms for the embedded edge, dataflow processors, and mixed-signal neuromorphic chips. In-memory computing also helped boost AI, with three companies either incorporating it into their chips or providing specialized IP. Ways to connect chiplets, chips, and server racks was another area of activity, with Germany pumping more than $200 million into a graphene-based co-integrated optics system for massively parallel connectivity. Other optical interconnect approaches drew attention, as well, along with a way to make ultra-high density interconnects using liquid metal ink. https://lnkd.in/g2eY6g53 #semiconductor #AIhardware #startups #startupfunding #venturecapital TXOne Networks Black Semiconductor PsiQuantum Rivos Inc. Bright Machines Hailo Etched Blaize DEEPX Frore Systems SiMa.ai Axelera AI Prewave MetisX actnano PQShield Expedera Inc. Rain AI Innatera RaiderChip Liquid Instruments AlixLabs Prewave Thintronics® actnano Synthara AG ZeroPoint Technologies RAAAM™ Memory Technologies MetisX Flow Computing Morphing Machines Niobium Microsystems AMAG nanometro Atom Computing

Digital Twins Find Their Footing In IC Manufacturing:https://lnkd.in/gEU48sGB Momentum is building for digital twins in semiconductor manufacturing, tying together the various processes and steps to improve efficiency and quality, and to enable more flexibility in the fab and assembly house. By Laura Peters. #semiconductor #digitaltwins #semiconductormanufacturing Anjaneya Thakar Joseph Ervin Lam Research Synopsys Inc James Moyne Sameer Kher Ansys Indranil Sircar Microsoft PDF Solutions Ranjan Chatterjee SEMI University of Michigan

Thermal Challenges Multiply In Automotive, Embedded Devices The small sizes and tight tolerances of embedded devices create big problems for reliability. https://lnkd.in/gyzPWcFH #embedded #thermalmanagement #semiconductor #automotive Ketan Dewan Infineon Technologies Marc Swinnen Ansys John Ferguson Siemens Digital Industries Software Melika Roshandell Cadence Design Systems geoffrey tate Flex Logix Technologies, Inc. Nordson TEST & INSPECTION

Big Shift: Creating Automotive SW Without HW: https://lnkd.in/g4vhYJd3 Agile development may be the best approach for designing new vehicles, but it requires a complete mindset shift for carmakers, particularly with mixed criticality. [Part 2 of roundtable series.] By Ann Mutschler. The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm‘s automotive line of business; Charles Alpert, R&D automotive fellow at Cadence Design Systems; Stefano (Steve) Spadoni, zone controller and power distribution application manager at Infineon Technologies; Rebeca Delgado, chief technology officer and principal AI engineer at Intel Corporation Automotive; Cyril Clocher, senior director in the automotive product line for high-performance computing at Renesas Electronics; David Fritz, vice president, hybrid and virtual systems at Siemens Digital Industries Software EDA; and Marc Serughetti, senior director, systems design group at Synopsys Inc.  [Find part 1 here https://lnkd.in/gVMf6iaa] #automotive #softwaredefinedvehicles #SDV #agile