Stability of the gold/silica thin film interface: electrochemical and surface plasmon resonance studies

Langmuir. 2006 Dec 5;22(25):10716-22. doi: 10.1021/la060793o.

Abstract

This article reports chemical stability studies of a gold film electrode coated with thin silicon oxide (SiOx) layers using electrochemical, surface plasmon resonance (SPR) and atomic force microscopy (AFM) techniques. Silica films with different thicknesses (d = 6.4, 9.7, 14.5, and 18.5 nm) were deposited using a plasma-enhanced chemical vapor deposition technique (PECVD). For SiOx films with d >/= 18.5 nm, the electrochemical behavior is characteristic of a highly efficient barrier for a redox probe. SiOx films with thicknesses between 9.5 and 14.5 nm were found to be less efficient barriers for electron transfer. The Au/SiOx interface with 6.4 nm of SiOx, however, showed an enhanced steady-state current compared to that of the other films. The stability of this interface in solutions of different pH was investigated. Whereas a strongly basic solution led to a continuous dissolution of the SiOx interface, acidic treatment produced a more reticulated SiOx film and improved electrochemical behavior. The electrochemical results were corroborated by SPR measurements in real time and AFM studies.

Publication types

  • Research Support, Non-U.S. Gov't

MeSH terms

  • Electrochemistry
  • Gold / chemistry*
  • Membranes, Artificial*
  • Microscopy, Atomic Force / methods
  • Particle Size
  • Sensitivity and Specificity
  • Silicon Dioxide / chemistry*
  • Surface Plasmon Resonance / methods*
  • Surface Properties

Substances

  • Membranes, Artificial
  • Gold
  • Silicon Dioxide