A connection technique for two-dimensional array ultrasound transducers developed by combining a conductive lambda/4 mismatching layer with a multi-layer ceramic (MLC) connector using thick-film microelectronic technology is described. The connector consists of 20 thick films of alumina and screen printed metallization with customized interconnections between the layers called vias. Ten ground layers are interleaved between ten signal layers to reduce elecrical crosstalk. A lambda/4 mismatching layer of conductive epoxy is bonded between each PZT element and the silver metal pad of the MLC connector to provide an effective low impedance backing. In the current configuration, a 16x16 transducer array, 0.6 mm element spacing, is expanded to a 16x16 grid of connector pins at a standard spacing of 2.5 mm. Vector impedance, sensitivity, bandwidth, interelement uniformity, and crosstalk are all in good agreement with arrays of conventional fabrication. However, an array with MLC connector can be fabricated more quickly independent of the number of elements.