Copper UPD as non-specific adsorption barrier in electrochemical displacement immunosensors

Biosens Bioelectron. 2009 Mar 15;24(7):2205-10. doi: 10.1016/j.bios.2008.11.032. Epub 2008 Dec 13.

Abstract

Non-specific adsorption events are responsible to a large extent for the lack of reliability and applicability of electrochemical immunosensors. In the particular case of displacement-based immunosensors, as an approach to achieve reagentless, labelless and easy to use immunosensors, the hindering effect of then non-specific adsorption is amplified when the system presents a low affinity constant between biorecognition element and target. The application of Copper UPD as non-specific adsorption barrier in combination with the use of self-assembled monolayers (SAM) to provide efficient binding of biomolecules to the immunosensor electrode surface is shown to be a very promising mechanism to construct protein resistant surfaces with no harming effects on the electrochemical transducing mechanism. The electrochemical immunodetection of TCA (2,4,6-Trichloroanisole) has been chosen as example for a real case study. A monoclonal antibody to detect the target TCA and an appropriate sub-optimum antigen were used. In addition to a rational strategy for displacement immunosensor development, the decrease of non-specific adsorption phenomena by introducing Copper UPD is reported here. With such strategy an electrochemical displacement immunosensor with a limit of detection of 200ppb and response time of 10min is achieved.

Publication types

  • Evaluation Study
  • Research Support, Non-U.S. Gov't

MeSH terms

  • Adsorption
  • Anisoles / analysis*
  • Anisoles / chemistry*
  • Biosensing Techniques / instrumentation*
  • Copper / chemistry*
  • Electrochemistry / instrumentation*
  • Electrodes*
  • Electroplating / methods
  • Equipment Design
  • Equipment Failure Analysis
  • Immunoassay / instrumentation*
  • Reproducibility of Results
  • Sensitivity and Specificity

Substances

  • Anisoles
  • 2,4,6-trichloroanisole
  • Copper