Electronic Structure and Charge-Trapping Characteristics of the Al2O3-TiAlO-SiO2 Gate Stack for Nonvolatile Memory Applications

Nanoscale Res Lett. 2017 Dec;12(1):270. doi: 10.1186/s11671-017-2040-x. Epub 2017 Apr 13.

Abstract

In this work, high-k composite TiAlO film has been investigated as charge-trapping material for nonvolatile memory applications. The annealing formed Al2O3-TiAlO-SiO2 dielectric stack demonstrates significant memory effects and excellent reliability properties. The memory device exhibits a large memory window of ~2.6 V under ±8 V sweeping voltage, and it shows only ~14% charge loss after more than 10 years' retention, indicating excellent charge retention properties. The electronic structures of the Al2O3-TiAlO-SiO2 have been studied by X-ray photoelectron spectroscopy measurements, and it reveals that the quantum well and the defect traps in TiAlO film can provide a >1.8 eV deep barrier for charge confinement in the TiAlO layer. The mixing between Al2O3 and TiO2 can increase the defects related to the under-coordinated Ti3+ atoms, thereby enhancing the charge-trapping efficiency of the device. Our work implies that high-k TiAlO composite film is promising for applications in future nonvolatile charge-trapping memories.

Keywords: Charge trapping; High-k dielectrics; Nonvolatile memory; TiAlO.