Materials and Structures toward Soft Electronics

Chunfeng Wang; Chonghe Wang; Zhenlong Huang; Sheng Xu

doi:10.1002/adma.201801368

Materials and Structures toward Soft Electronics

Adv Mater. 2018 Dec;30(50):e1801368. doi: 10.1002/adma.201801368. Epub 2018 Aug 2.

Authors

Chunfeng Wang^{1

2}, Chonghe Wang¹, Zhenlong Huang^{1

3}, Sheng Xu^{1

4}

Affiliations

¹ Department of Nanoengineering, University of California San Diego, La Jolla, CA, 92093, USA.
² School of Materials Science and Engineering, National Engineering Research Center for Advanced Polymer Processing Technology, School of Physics and Engineering, Zhengzhou University, Zhengzhou, Henan, 450001, P. R. China.
³ State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan, 610054, P. R. China.
⁴ Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, 92093, USA.

PMID: 30073715
DOI: 10.1002/adma.201801368

Abstract

Soft electronics are intensively studied as the integration of electronics with dynamic nonplanar surfaces has become necessary. Here, a discussion of the strategies in materials innovation and structural design to build soft electronic devices and systems is provided. For each strategy, the presentation focuses on the fundamental materials science and mechanics, and example device applications are highlighted where possible. Finally, perspectives on the key challenges and future directions of this field are presented.

Keywords: materials innovation; soft electronics; stretchable electronics; structural design; wearable electronics.

Publication types

Review

Abstract

Publication types

Grants and funding