Publisher Correction: Carrier lifetime enhancement in halide perovskite via remote epitaxy

Affiliations

• ¹ Department of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, Yunnan, 650093, China.
• ² Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, 12180, USA.
• ³ Department of Physics, Applied Physics and Astronomy, Rensselaer Polytechnic Institute, Troy, NY, 12180, USA.
• ⁴ State Key Laboratory of Tribology, Tsinghua University, Beijing, 100084, China.
• ⁵ Beijing Advanced Innovation Center for Materials Genome Engineering, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, China.
• ⁶ Beijing Advanced Innovation Center for Materials Genome Engineering, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, China. [email protected].
• ⁷ Ernst Ruska-Centre for Microscopy and Spectroscopy with Electrons and Peter Grünberg Institute, Forschungszentrum Jülich, Jülich, Germany.
• ⁸ School of Engineering, Brown University, Providence, RI, 02912, USA.
• ⁹ Department of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, Yunnan, 650093, China. [email protected].
• ¹⁰ Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, 12180, USA. [email protected].
• ¹¹ Center for Materials, Devices, and Integrated Systems, Rensselaer Polytechnic Institute, Troy, NY, 12180, USA. [email protected].