Current miniaturized ultrasound transducers suffer from insufficient attenuation from the backing layer due to their limited thickness. The thickness of the backing layer is one of the critical factors determining the device size and transducer performance for miniaturized transducers inserted and operated in a limited space. Glass bubbles, polyamide resin, and tungsten powder are combined to form a new highly attenuative backing material. It has high attenuation (>160 dB/cm at 5 MHz), which is five times greater than silver-based conductive epoxy commonly used for high-frequency ultrasound transducers, appropriate acoustic impedance (4.6 MRayl), and acceptable damping capability. An intravascular ultrasound (IVUS) transducer constructed with the 170 [Formula: see text] of the proposed backing layer demonstrated that the amplitude of the signal returned from the backing layer was 1.8 times smaller, with ring-down attenuated by 6 dB. Wire-phantom imaging revealed that the axial resolution was 30% better with the suggested backing than silver-based conductive epoxy backing. Because of its excellent attenuation capability even at a limited thickness, simple manufacturing process, and easy customization capability, the suggested highly attenuative backing layer may be used for miniaturized ultrasound transducers.