Fabrication of Titanium and Copper-Coated Diamond/Copper Composites via Selective Laser Melting

Micromachines (Basel). 2022 Apr 30;13(5):724. doi: 10.3390/mi13050724.

Abstract

The poor wettability and weak interfacial bonding of diamond/copper composites are due to the incompatibility between diamond and copper which are inorganic nonmetallic and metallic material, respectively, which limit their further application in next-generation heat management materials. Coating copper and titanium on the diamond particle surface could effectively modify and improve the wettability of the diamond/copper interface via electroless plating and evaporation methods, respectively. Here, these dense and complex composites were successfully three-dimensionally printed via selective laser melting. A high thermal conductivity (TC, 336 W/mK) was produced by 3D printing 1 vol.% copper-coated diamond/copper mixed powders at an energy density of 300 J/mm3 (laser power = 180 W and scanning rate = 200 mm/s). 1 and 3 vol.% copper-coated diamond/copper composites had lower coefficients of thermal expansions and higher TCs. They also had stronger bending strengths than the corresponding titanium-coated diamond/copper composites. The interface between copper matrix and diamond reinforcement was well bonded, and there was no cracking in the 1 vol.% copper-coated diamond/copper composite sample. The optimization of the printing parameters and strategy herein is beneficial to develop new approaches for the further construction of a wider range of micro-sized diamond particles reinforced metal matrix composites.

Keywords: copper-coated diamond/copper composites; selective laser melting; thermal management materials; titanium-coated diamond/copper composites.

Grants and funding

This research is funded by Wuhan Applied Foundational Frontier Project from Wuhan Science and Technology Bureau Project, China (No. 2020010601012172), the National Natural Science Foundation of China (No. 61805095, No. 51675496, No. 51902295), and the Fundamental Research Funds for the Central Universities, China University of Geosciences (Wuhan) (No. CUG2021234).