Correction: Nimbalkar et al. A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates. Polymers 2023, 15, 3895

Polymers (Basel). 2024 Sep 29;16(19):2751. doi: 10.3390/polym16192751.

Authors

Pratik Nimbalkar¹, Pragna Bhaskar¹, Mohanalingam Kathaperumal¹, Madhavan Swaminathan², Rao R Tummala¹

Affiliations

¹ 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332, USA.
² Department of Electrical Engineering, Pennsylvania State University, University Park, PA 16802, USA.

Abstract

In the original publication [...].

Publication types

Published Erratum