Supramolecular Luminescent Copper-Nanocluster-Based Dough with Excellent Electrical Conductivity Sensing Properties

ACS Appl Mater Interfaces. 2024 Oct 18. doi: 10.1021/acsami.4c13501. Online ahead of print.

Abstract

In recent years, the rapid advancement of flexible conductive materials has significantly increased the demand for dough materials that offer high flexibility and conductivity for diverse applications. Here, we developed a flexible, stretchable, and self-healing dough utilizing hydrogen-bonding interactions between glutathione-stabilized copper nanoclusters (GSH-Cu NCs) and poly(acrylic acid) (PAA). The dough materials can be kneaded, readily reshaped, and further processed to create bulk materials of arbitrary form factors. The incorporation of PAA not only preserved the vibrant blue emission of GSH-Cu NCs but also enhanced their electrical conductivity and stretchability. The dough can be stretched up to 25 times its initial length and achieves complete self-healing in a short time. Moreover, the dough can automatically repair physical damage and return to its initial conductivity levels after healing. Surprisingly, the electrical conductivity of the dough can reach as high as 2.97 S/m, which is relatively superior compared to that of conventional conductive materials. This study presents a dough that serves as a highly sensitive strain sensor, capable of effectively monitoring human movement across a broad range of strains.

Keywords: flexible conductive materials; fluorescence; hydrogen bonding; metal nanoclusters; polymers.