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Kim KR, Kang SJ, Lee AY, Hwang D, Park M, Park H, Kim S, Hur K, Chung HS, Mao C, Ahn DR.Kim KR, et al. Among authors: mao c.Biomaterials. 2019 Mar;195:1-12. doi: 10.1016/j.biomaterials.2018.12.026. Epub 2018 Dec 26.Biomaterials. 2019.PMID: 30593871
Liu X, Wang G, You Z, Qian P, Chen H, Dou Y, Wei Z, Chen Y, Mao C, Zhang J.Liu X, et al. Among authors: mao c.Biomaterials. 2014 May;35(14):4401-16. doi: 10.1016/j.biomaterials.2014.02.009. Epub 2014 Feb 26.Biomaterials. 2014.PMID: 24582377
Tian C, Li X, Liu Z, Jiang W, Wang G, Mao C.Tian C, et al. Among authors: mao c.Angew Chem Int Ed Engl. 2014 Jul 28;53(31):8041-4. doi: 10.1002/anie.201400377. Epub 2014 Mar 12.Angew Chem Int Ed Engl. 2014.PMID: 24623616
Thai HBD, Kim KR, Hong KT, Voitsitskyi T, Lee JS, Mao C, Ahn DR.Thai HBD, et al. Among authors: mao c.ACS Cent Sci. 2020 Dec 23;6(12):2250-2258. doi: 10.1021/acscentsci.0c00763. Epub 2020 Nov 17.ACS Cent Sci. 2020.PMID: 33376785Free PMC article.
Kim KR, Kim J, Mao C, Ahn DR.Kim KR, et al. Among authors: mao c.Biomater Sci. 2021 Dec 7;9(24):8148-8152. doi: 10.1039/d1bm01440d.Biomater Sci. 2021.PMID: 34755728
Kim KR, Kang JH, Thai HBD, Back JH, Mao C, Lee JE, Ko YT, Ahn DR.Kim KR, et al. Among authors: mao c.Small Methods. 2024 Aug 2:e2400902. doi: 10.1002/smtd.202400902. Online ahead of print.Small Methods. 2024.PMID: 39092676
Deng Z, Mao C.Deng Z, et al. Among authors: mao c.Angew Chem Int Ed Engl. 2004 Aug 6;43(31):4068-70. doi: 10.1002/anie.200460257.Angew Chem Int Ed Engl. 2004.PMID: 15300697No abstract available.
He Y, Tian Y, Chen Y, Deng Z, Ribbe AE, Mao C.He Y, et al. Among authors: mao c.Angew Chem Int Ed Engl. 2005 Oct 21;44(41):6694-6. doi: 10.1002/anie.200502193.Angew Chem Int Ed Engl. 2005.PMID: 16187389No abstract available.
He Y, Mao C.He Y, et al. Among authors: mao c.Chem Commun (Camb). 2006 Mar 7;(9):968-9. doi: 10.1039/b513962g. Epub 2006 Jan 20.Chem Commun (Camb). 2006.PMID: 16491178
He Y, Liu H, Chen Y, Tian Y, Deng Z, Ko SH, Ye T, Mao C.He Y, et al. Among authors: mao c.Microsc Res Tech. 2007 Jun;70(6):522-9. doi: 10.1002/jemt.20475.Microsc Res Tech. 2007.PMID: 17479986Review.