A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images.
Zhan D, Lin J, Yang X, Huang R, Yi K, Liu M, Zheng H, Xiong J, Cai N, Wang H, Qiu B.
Zhan D, et al. Among authors: cai n.
Micromachines (Basel). 2023 May 26;14(6):1119. doi: 10.3390/mi14061119.
Micromachines (Basel). 2023.
PMID: 37374704
Free PMC article.