Assembly of complex 3D structures and electronics on curved surfaces.
Xue Z, Jin T, Xu S, Bai K, He Q, Zhang F, Cheng X, Ji Z, Pang W, Shen Z, Song H, Shuai Y, Zhang Y.
Xue Z, et al. Among authors: song h.
Sci Adv. 2022 Aug 12;8(32):eabm6922. doi: 10.1126/sciadv.abm6922. Epub 2022 Aug 10.
Sci Adv. 2022.
PMID: 35947653
Free PMC article.