Kao CR - Search Results

1

Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling.

Chang FL, Lin YH, Hung HT, Kao CW, Kao CR. Chang FL, et al. Among authors: kao cr. Materials (Basel). 2023 Apr 22;16(9):3290. doi: 10.3390/ma16093290. Materials (Basel). 2023. PMID: 37176172 Free PMC article.

2

Development of Ag-In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices.

Tsai CH, Huang WC, Kao CR. Tsai CH, et al. Among authors: kao cr. Materials (Basel). 2022 Feb 14;15(4):1397. doi: 10.3390/ma15041397. Materials (Basel). 2022. PMID: 35207937 Free PMC article.

3

Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps.

Kao CW, Kung PY, Chang CC, Huang WC, Chang FL, Kao CR. Kao CW, et al. Among authors: kao cr. Materials (Basel). 2022 Jun 17;15(12):4297. doi: 10.3390/ma15124297. Materials (Basel). 2022. PMID: 35744357 Free PMC article.

4

Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration.

Kung PY, Huang WL, Kao CL, Lin YS, Hung YC, Kao CR. Kung PY, et al. Among authors: kao cr. Materials (Basel). 2022 Nov 4;15(21):7783. doi: 10.3390/ma15217783. Materials (Basel). 2022. PMID: 36363374 Free PMC article.

5

Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate.

Hung HT, Chang FL, Tsai CH, Liao CY, Kao CR. Hung HT, et al. Among authors: kao cr. Materials (Basel). 2023 Sep 18;16(18):6263. doi: 10.3390/ma16186263. Materials (Basel). 2023. PMID: 37763541 Free PMC article.

6

Phase Equilibria Related to NiGa₅ in the Binary Ni-Ga System.

Chang CB, Kao CR. Chang CB, et al. Among authors: kao cr. Materials (Basel). 2024 Feb 14;17(4):883. doi: 10.3390/ma17040883. Materials (Basel). 2024. PMID: 38399134 Free PMC article.

7

A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications.

Huang JH, Shih PS, Renganathan V, Gräfner SJ, Lin YC, Kao CL, Lin YS, Hung YC, Kao CR. Huang JH, et al. Among authors: kao cr. Materials (Basel). 2024 Apr 3;17(7):1638. doi: 10.3390/ma17071638. Materials (Basel). 2024. PMID: 38612152 Free PMC article.

8

Impact of crystalline orientation on Cu-Cu solid-state bonding behavior by molecular dynamics simulations.

Tatsumi H, Kao CR, Nishikawa H. Tatsumi H, et al. Among authors: kao cr. Sci Rep. 2023 Dec 27;13(1):23030. doi: 10.1038/s41598-023-50427-3. Sci Rep. 2023. PMID: 38155208 Free PMC article.

9

Facile stoichiometric interfacial surface bonded cerium oxide and graphene oxide heterostructure for efficient electrochemical non-enzymatic detection of dopamine.

Annadurai H, Vengudusamy R, Chen SM, Kao CR. Annadurai H, et al. Among authors: kao cr. J Mater Chem B. 2024 Oct 9;12(39):9979-9990. doi: 10.1039/d4tb01729c. J Mater Chem B. 2024. PMID: 39229782

10

Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation.

Tatsumi H, Kao CR, Nishikawa H. Tatsumi H, et al. Among authors: kao cr. Sci Rep. 2022 Jul 26;12(1):12755. doi: 10.1038/s41598-022-17119-w. Sci Rep. 2022. PMID: 35882897 Free PMC article.

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