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An Evaluation of Continual Learning for Advanced Node Semiconductor Defect Inspection
Authors:
Amit Prasad,
Bappaditya Dey,
Victor Blanco,
Sandip Halder
Abstract:
Deep learning-based semiconductor defect inspection has gained traction in recent years, offering a powerful and versatile approach that provides high accuracy, adaptability, and efficiency in detecting and classifying nano-scale defects. However, semiconductor manufacturing processes are continually evolving, leading to the emergence of new types of defects over time. This presents a significant…
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Deep learning-based semiconductor defect inspection has gained traction in recent years, offering a powerful and versatile approach that provides high accuracy, adaptability, and efficiency in detecting and classifying nano-scale defects. However, semiconductor manufacturing processes are continually evolving, leading to the emergence of new types of defects over time. This presents a significant challenge for conventional supervised defect detectors, as they may suffer from catastrophic forgetting when trained on new defect datasets, potentially compromising performance on previously learned tasks. An alternative approach involves the constant storage of previously trained datasets alongside pre-trained model versions, which can be utilized for (re-)training from scratch or fine-tuning whenever encountering a new defect dataset. However, adhering to such a storage template is impractical in terms of size, particularly when considering High-Volume Manufacturing (HVM). Additionally, semiconductor defect datasets, especially those encompassing stochastic defects, are often limited and expensive to obtain, thus lacking sufficient representation of the entire universal set of defectivity. This work introduces a task-agnostic, meta-learning approach aimed at addressing this challenge, which enables the incremental addition of new defect classes and scales to create a more robust and generalized model for semiconductor defect inspection. We have benchmarked our approach using real resist-wafer SEM (Scanning Electron Microscopy) datasets for two process steps, ADI and AEI, demonstrating its superior performance compared to conventional supervised training methods.
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Submitted 17 July, 2024;
originally announced July 2024.
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Addressing Class Imbalance and Data Limitations in Advanced Node Semiconductor Defect Inspection: A Generative Approach for SEM Images
Authors:
Bappaditya Dey,
Vic De Ridder,
Victor Blanco,
Sandip Halder,
Bartel Van Waeyenberge
Abstract:
Precision in identifying nanometer-scale device-killer defects is crucial in both semiconductor research and development as well as in production processes. The effectiveness of existing ML-based approaches in this context is largely limited by the scarcity of data, as the production of real semiconductor wafer data for training these models involves high financial and time costs. Moreover, the ex…
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Precision in identifying nanometer-scale device-killer defects is crucial in both semiconductor research and development as well as in production processes. The effectiveness of existing ML-based approaches in this context is largely limited by the scarcity of data, as the production of real semiconductor wafer data for training these models involves high financial and time costs. Moreover, the existing simulation methods fall short of replicating images with identical noise characteristics, surface roughness and stochastic variations at advanced nodes. We propose a method for generating synthetic semiconductor SEM images using a diffusion model within a limited data regime. In contrast to images generated through conventional simulation methods, SEM images generated through our proposed DL method closely resemble real SEM images, replicating their noise characteristics and surface roughness adaptively. Our main contributions, which are validated on three different real semiconductor datasets, are: i) proposing a patch-based generative framework utilizing DDPM to create SEM images with intended defect classes, addressing challenges related to class-imbalance and data insufficiency, ii) demonstrating generated synthetic images closely resemble real SEM images acquired from the tool, preserving all imaging conditions and metrology characteristics without any metadata supervision, iii) demonstrating a defect detector trained on generated defect dataset, either independently or combined with a limited real dataset, can achieve similar or improved performance on real wafer SEM images during validation/testing compared to exclusive training on a real defect dataset, iv) demonstrating the ability of the proposed approach to transfer defect types, critical dimensions, and imaging conditions from one specified CD/Pitch and metrology specifications to another, thereby highlighting its versatility.
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Submitted 14 July, 2024;
originally announced July 2024.
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Towards Improved Semiconductor Defect Inspection for high-NA EUVL based on SEMI-SuperYOLO-NAS
Authors:
Ying-Lin Chen,
Jacob Deforce,
Vic De Ridder,
Bappaditya Dey,
Victor Blanco,
Sandip Halder,
Philippe Leray
Abstract:
Due to potential pitch reduction, the semiconductor industry is adopting High-NA EUVL technology. However, its low depth of focus presents challenges for High Volume Manufacturing. To address this, suppliers are exploring thinner photoresists and new underlayers/hardmasks. These may suffer from poor SNR, complicating defect detection. Vision-based ML algorithms offer a promising solution for semic…
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Due to potential pitch reduction, the semiconductor industry is adopting High-NA EUVL technology. However, its low depth of focus presents challenges for High Volume Manufacturing. To address this, suppliers are exploring thinner photoresists and new underlayers/hardmasks. These may suffer from poor SNR, complicating defect detection. Vision-based ML algorithms offer a promising solution for semiconductor defect inspection. However, developing a robust ML model across various image resolutions without explicit training remains a challenge for nano-scale defect inspection. This research's goal is to propose a scale-invariant ADCD framework capable to upscale images, addressing this issue. We propose an improvised ADCD framework as SEMI-SuperYOLO-NAS, which builds upon the baseline YOLO-NAS architecture. This framework integrates a SR assisted branch to aid in learning HR features by the defect detection backbone, particularly for detecting nano-scale defect instances from LR images. Additionally, the SR-assisted branch can recursively generate upscaled images from their corresponding downscaled counterparts, enabling defect detection inference across various image resolutions without requiring explicit training. Moreover, we investigate improved data augmentation strategy aimed at generating diverse and realistic training datasets to enhance model performance. We have evaluated our proposed approach using two original FAB datasets obtained from two distinct processes and captured using two different imaging tools. Finally, we demonstrate zero-shot inference for our model on a new, originating from a process condition distinct from the training dataset and possessing different Pitch characteristics. Experimental validation demonstrates that our proposed ADCD framework aids in increasing the throughput of imaging tools for defect inspection by reducing the required image pixel resolutions.
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Submitted 8 April, 2024;
originally announced April 2024.
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Applying Machine Learning Models on Metrology Data for Predicting Device Electrical Performance
Authors:
Bappaditya Dey,
Anh Tuan Ngo,
Sara Sacchi,
Victor Blanco,
Philippe Leray,
Sandip Halder
Abstract:
Moore Law states that transistor density will double every two years, which is sustained until today due to continuous multi-directional innovations, such as extreme ultraviolet lithography, novel patterning techniques etc., leading the semiconductor industry towards 3nm node and beyond. For any patterning scheme, the most important metric to evaluate the quality of printed patterns is EPE, with o…
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Moore Law states that transistor density will double every two years, which is sustained until today due to continuous multi-directional innovations, such as extreme ultraviolet lithography, novel patterning techniques etc., leading the semiconductor industry towards 3nm node and beyond. For any patterning scheme, the most important metric to evaluate the quality of printed patterns is EPE, with overlay being its largest contribution. Overlay errors can lead to fatal failures of IC devices such as short circuits or broken connections in terms of P2P electrical contacts. Therefore, it is essential to develop effective overlay analysis and control techniques to ensure good functionality of fabricated semiconductor devices. In this work we have used an imec N14 BEOL process flow using LELE patterning technique to print metal layers with minimum pitch of 48nm with 193i lithography. FF structures are decomposed into two mask layers (M1A and M1B) and then the LELE flow is carried out to make the final patterns. Since a single M1 layer is decomposed into two masks, control of overlay between the two masks is critical. The goal of this work is of two-fold as, (a) to quantify the impact of overlay on capacitance and (b) to see if we can predict the final capacitance measurements with selected machine learning models at an early stage. To do so, scatterometry spectra are collected on these electrical test structures at (a)post litho, (b)post TiN hardmask etch, and (c)post Cu plating and CMP. Critical Dimension and overlay measurements for line-space pattern are done with SEM post litho, post etch and post Cu CMP. Various machine learning models are applied to do the capacitance prediction with multiple metrology inputs at different steps of wafer processing. Finally, we demonstrate that by using appropriate machine learning models we are able to do better prediction of electrical results.
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Submitted 20 November, 2023;
originally announced December 2023.
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Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy
Authors:
Vic De Ridder,
Bappaditya Dey,
Victor Blanco,
Sandip Halder,
Bartel Van Waeyenberge
Abstract:
In semiconductor manufacturing, lithography has often been the manufacturing step defining the smallest possible pattern dimensions. In recent years, progress has been made towards high-NA (Numerical Aperture) EUVL (Extreme-Ultraviolet-Lithography) paradigm, which promises to advance pattern shrinking (2 nm node and beyond). However, a significant increase in stochastic defects and the complexity…
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In semiconductor manufacturing, lithography has often been the manufacturing step defining the smallest possible pattern dimensions. In recent years, progress has been made towards high-NA (Numerical Aperture) EUVL (Extreme-Ultraviolet-Lithography) paradigm, which promises to advance pattern shrinking (2 nm node and beyond). However, a significant increase in stochastic defects and the complexity of defect detection becomes more pronounced with high-NA. Present defect inspection techniques (both non-machine learning and machine learning based), fail to achieve satisfactory performance at high-NA dimensions. In this work, we investigate the use of the Slicing Aided Hyper Inference (SAHI) framework for improving upon current techniques. Using SAHI, inference is performed on size-increased slices of the SEM images. This leads to the object detector's receptive field being more effective in capturing small defect instances. First, the performance on previously investigated semiconductor datasets is benchmarked across various configurations, and the SAHI approach is demonstrated to substantially enhance the detection of small defects, by approx. 2x. Afterwards, we also demonstrated application of SAHI leads to flawless detection rates on a new test dataset, with scenarios not encountered during training, whereas previous trained models failed. Finally, we formulate an extension of SAHI that does not significantly reduce true-positive predictions while eliminating false-positive predictions.
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Submitted 21 November, 2023; v1 submitted 19 November, 2023;
originally announced November 2023.
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Proceedings of the XII International Workshop on Locational Analysis and Related Problems
Authors:
Marta Baldomero-Naranjo,
Víctor Blanco,
Sergio García,
Ricardo Gázquez,
Jörg Kalcsics,
Luisa I. Martínez-Merino,
Juan M. Muñoz-Ocaña,
Francisco Temprano,
Alberto Torrejón
Abstract:
The International Workshop on Locational Analysis and Related Problems will take place during September 7-8, 2023 in Edinburgh (United Kingdom). It is organized by the Spanish Location Network and the Location Group GELOCA from the Spanish Society of Statistics and Operations Research (SEIO). The Spanish Location Network is a group of more than 140 researchers from several Spanish universities org…
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The International Workshop on Locational Analysis and Related Problems will take place during September 7-8, 2023 in Edinburgh (United Kingdom). It is organized by the Spanish Location Network and the Location Group GELOCA from the Spanish Society of Statistics and Operations Research (SEIO). The Spanish Location Network is a group of more than 140 researchers from several Spanish universities organized into 7 thematic groups. The Network has been funded by the Spanish Government since 2003. The current project is RED2022-134149-T. One of the main activities of the Network is a yearly meeting aimed at promoting the communication among its members and between them and other researchers, and to contribute to the development of the location field and related problems. As a proof of the internationalization of this research group, this will be the first time that the meeting is held out of Spain. The topics of interest are location analysis and related problems. This includes location models, networks, transportation, logistics, exact and heuristic solution methods, and computational geometry, among others.
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Submitted 5 October, 2023; v1 submitted 15 September, 2023;
originally announced September 2023.
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Automated Semiconductor Defect Inspection in Scanning Electron Microscope Images: a Systematic Review
Authors:
Thibault Lechien,
Enrique Dehaerne,
Bappaditya Dey,
Victor Blanco,
Sandip Halder,
Stefan De Gendt,
Wannes Meert
Abstract:
A growing need exists for efficient and accurate methods for detecting defects in semiconductor materials and devices. These defects can have a detrimental impact on the efficiency of the manufacturing process, because they cause critical failures and wafer-yield limitations. As nodes and patterns get smaller, even high-resolution imaging techniques such as Scanning Electron Microscopy (SEM) produ…
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A growing need exists for efficient and accurate methods for detecting defects in semiconductor materials and devices. These defects can have a detrimental impact on the efficiency of the manufacturing process, because they cause critical failures and wafer-yield limitations. As nodes and patterns get smaller, even high-resolution imaging techniques such as Scanning Electron Microscopy (SEM) produce noisy images due to operating close to sensitivity levels and due to varying physical properties of different underlayers or resist materials. This inherent noise is one of the main challenges for defect inspection. One promising approach is the use of machine learning algorithms, which can be trained to accurately classify and locate defects in semiconductor samples. Recently, convolutional neural networks have proved to be particularly useful in this regard. This systematic review provides a comprehensive overview of the state of automated semiconductor defect inspection on SEM images, including the most recent innovations and developments. 38 publications were selected on this topic, indexed in IEEE Xplore and SPIE databases. For each of these, the application, methodology, dataset, results, limitations and future work were summarized. A comprehensive overview and analysis of their methods is provided. Finally, promising avenues for future work in the field of SEM-based defect inspection are suggested.
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Submitted 18 August, 2023; v1 submitted 16 August, 2023;
originally announced August 2023.
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A Mathematical Programming Approach to Optimal Classification Forests
Authors:
Víctor Blanco,
Alberto Japón,
Justo Puerto,
Peter Zhang
Abstract:
In this paper, we introduce Optimal Classification Forests, a new family of classifiers that takes advantage of an optimal ensemble of decision trees to derive accurate and interpretable classifiers. We propose a novel mathematical optimization-based methodology in which a given number of trees are simultaneously constructed, each of them providing a predicted class for the observations in the fea…
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In this paper, we introduce Optimal Classification Forests, a new family of classifiers that takes advantage of an optimal ensemble of decision trees to derive accurate and interpretable classifiers. We propose a novel mathematical optimization-based methodology in which a given number of trees are simultaneously constructed, each of them providing a predicted class for the observations in the feature space. The classification rule is derived by assigning to each observation its most frequently predicted class among the trees in the forest. We provide a mixed integer linear programming formulation for the problem. We report the results of our computational experiments, from which we conclude that our proposed method has equal or superior performance compared with state-of-the-art tree-based classification methods. More importantly, it achieves high prediction accuracy with, for example, orders of magnitude fewer trees than random forests. We also present three real-world case studies showing that our methodology has very interesting implications in terms of interpretability.
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Submitted 23 April, 2023; v1 submitted 18 November, 2022;
originally announced November 2022.
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Multiclass Optimal Classification Trees with SVM-splits
Authors:
Víctor Blanco,
Alberto Japón,
Justo Puerto
Abstract:
In this paper we present a novel mathematical optimization-based methodology to construct tree-shaped classification rules for multiclass instances. Our approach consists of building Classification Trees in which, except for the leaf nodes, the labels are temporarily left out and grouped into two classes by means of a SVM separating hyperplane. We provide a Mixed Integer Non Linear Programming for…
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In this paper we present a novel mathematical optimization-based methodology to construct tree-shaped classification rules for multiclass instances. Our approach consists of building Classification Trees in which, except for the leaf nodes, the labels are temporarily left out and grouped into two classes by means of a SVM separating hyperplane. We provide a Mixed Integer Non Linear Programming formulation for the problem and report the results of an extended battery of computational experiments to assess the performance of our proposal with respect to other benchmarking classification methods.
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Submitted 16 November, 2021;
originally announced November 2021.
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Network Flow based approaches for the Pipelines Routing Problem in Naval Design
Authors:
Víctor Blanco,
Gabriel González,
Yolanda Hinojosa,
Diego Ponce,
Miguel A. Pozo,
Justo Puerto
Abstract:
In this paper we propose a general methodology for the optimal automatic routing of spatial pipelines motivated by a recent collaboration with Ghenova, a leading Naval Engineering company. We provide a minimum cost multicommodity network flow based model for the problem incorporating all the technical requirements for a feasible pipeline routing. A branch-and-cut approach is designed and different…
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In this paper we propose a general methodology for the optimal automatic routing of spatial pipelines motivated by a recent collaboration with Ghenova, a leading Naval Engineering company. We provide a minimum cost multicommodity network flow based model for the problem incorporating all the technical requirements for a feasible pipeline routing. A branch-and-cut approach is designed and different matheuristic algorithms are derived for solving efficiently the problem. We report the results of a battery of computational experiments to assess the problem performance as well as a case study of a real-world naval instance provided by our partner company.
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Submitted 1 August, 2021;
originally announced August 2021.
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Robust Optimal Classification Trees under Noisy Labels
Authors:
Víctor Blanco,
Alberto Japón,
Justo Puerto
Abstract:
In this paper we propose a novel methodology to construct Optimal Classification Trees that takes into account that noisy labels may occur in the training sample. Our approach rests on two main elements: (1) the splitting rules for the classification trees are designed to maximize the separation margin between classes applying the paradigm of SVM; and (2) some of the labels of the training sample…
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In this paper we propose a novel methodology to construct Optimal Classification Trees that takes into account that noisy labels may occur in the training sample. Our approach rests on two main elements: (1) the splitting rules for the classification trees are designed to maximize the separation margin between classes applying the paradigm of SVM; and (2) some of the labels of the training sample are allowed to be changed during the construction of the tree trying to detect the label noise. Both features are considered and integrated together to design the resulting Optimal Classification Tree. We present a Mixed Integer Non Linear Programming formulation for the problem, suitable to be solved using any of the available off-the-shelf solvers. The model is analyzed and tested on a battery of standard datasets taken from UCI Machine Learning repository, showing the effectiveness of our approach.
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Submitted 15 December, 2020;
originally announced December 2020.
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Continuous maximal covering location problems with interconnected facilities
Authors:
Víctor Blanco,
Ricardo Gázquez
Abstract:
In this paper we analyze a continuous version of the maximal covering location problem, in which the facilities are required to be interconnected by means of a graph structure in which two facilities are allowed to be linked if a given distance is not exceed. We provide a mathematical programming framework for the problem and different resolution strategies. First, we propose a Mixed Integer Non L…
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In this paper we analyze a continuous version of the maximal covering location problem, in which the facilities are required to be interconnected by means of a graph structure in which two facilities are allowed to be linked if a given distance is not exceed. We provide a mathematical programming framework for the problem and different resolution strategies. First, we propose a Mixed Integer Non Linear Programming formulation, and derive properties of the problem that allow us to project the continuous variables out avoiding the nonlinear constraints, resulting in an equivalent pure integer programming formulation. Since the number of constraints in the integer programming formulation is large and the constraints are, in general, difficult to handle, we propose two branch-&-cut approaches that avoid the complete enumeration of the constraints resulting in more efficient procedures. We report the results of an extensive battery of computational experiments comparing the performance of the different approaches.
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Submitted 7 May, 2020;
originally announced May 2020.
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A Mathematical Programming approach to Binary Supervised Classification with Label Noise
Authors:
Víctor Blanco,
Alberto Japón,
Justo Puerto
Abstract:
In this paper we propose novel methodologies to construct Support Vector Machine -based classifiers that takes into account that label noises occur in the training sample. We propose different alternatives based on solving Mixed Integer Linear and Non Linear models by incorporating decisions on relabeling some of the observations in the training dataset. The first method incorporates relabeling di…
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In this paper we propose novel methodologies to construct Support Vector Machine -based classifiers that takes into account that label noises occur in the training sample. We propose different alternatives based on solving Mixed Integer Linear and Non Linear models by incorporating decisions on relabeling some of the observations in the training dataset. The first method incorporates relabeling directly in the SVM model while a second family of methods combines clustering with classification at the same time, giving rise to a model that applies simultaneously similarity measures and SVM. Extensive computational experiments are reported based on a battery of standard datasets taken from UCI Machine Learning repository, showing the effectiveness of the proposed approaches.
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Submitted 21 April, 2020;
originally announced April 2020.
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Upgrading nodes in tree-shaped hub location
Authors:
Víctor Blanco,
Alfredo Marín
Abstract:
In this paper, we introduce the Tree of Hubs Location Problem with Upgrading, a mixture of the Tree of Hubs Location Problem, presented by Contreras et. al (2010), and the Minimum Cost Spanning Tree Problem with Upgraded nodes, studied for the first time by Krumke (1999). In addition to locate the hubs, to determine the tree that connects the hubs and to allocate non-hub nodes to hubs, a decision…
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In this paper, we introduce the Tree of Hubs Location Problem with Upgrading, a mixture of the Tree of Hubs Location Problem, presented by Contreras et. al (2010), and the Minimum Cost Spanning Tree Problem with Upgraded nodes, studied for the first time by Krumke (1999). In addition to locate the hubs, to determine the tree that connects the hubs and to allocate non-hub nodes to hubs, a decision has to be made about which of the hubs will be upgraded, taking into account that the total number of upgraded nodes is given. We present two different Mixed Integer Linear Programming formulations for the problem, tighten the formulations and generate several families of valid inequalities for them. A computational study is presented showing the improvements attained with the strengthening of the formulations and comparing them.
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Submitted 14 February, 2018;
originally announced February 2018.
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Impact of contrarians and intransigents in a kinetic model of opinion dynamics
Authors:
Nuno Crokidakis,
Victor H. Blanco,
Celia Anteneodo
Abstract:
In this work we study opinion formation on a fully-connected population participating of a public debate with two distinct choices, where the agents may adopt three different attitudes (favorable to either one choice or to the other, or undecided). The interactions between agents occur by pairs and are competitive, with couplings that are either negative with probability $p$ or positive with proba…
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In this work we study opinion formation on a fully-connected population participating of a public debate with two distinct choices, where the agents may adopt three different attitudes (favorable to either one choice or to the other, or undecided). The interactions between agents occur by pairs and are competitive, with couplings that are either negative with probability $p$ or positive with probability $1-p$. This bimodal probability distribution of couplings produces a behavior similar to the one resulting from the introduction of Galam's contrarians in the population. In addition, we consider that a fraction $d$ of the individuals are intransigent, that is, reluctant to change their opinions. The consequences of the presence of contrarians and intransigents are studied by means of computer simulations. Our results suggest that the presence of inflexible agents affects the critical behavior of the system, causing either the shift of the critical point or the suppression of the ordering phase transition, depending on the groups of opinions intransigents belong to. We also discuss the relevance of the model for real social systems.
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Submitted 13 January, 2014;
originally announced January 2014.
