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JointViT: Modeling Oxygen Saturation Levels with Joint Supervision on Long-Tailed OCTA
Authors:
Zeyu Zhang,
Xuyin Qi,
Mingxi Chen,
Guangxi Li,
Ryan Pham,
Ayub Qassim,
Ella Berry,
Zhibin Liao,
Owen Siggs,
Robert Mclaughlin,
Jamie Craig,
Minh-Son To
Abstract:
The oxygen saturation level in the blood (SaO2) is crucial for health, particularly in relation to sleep-related breathing disorders. However, continuous monitoring of SaO2 is time-consuming and highly variable depending on patients' conditions. Recently, optical coherence tomography angiography (OCTA) has shown promising development in rapidly and effectively screening eye-related lesions, offeri…
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The oxygen saturation level in the blood (SaO2) is crucial for health, particularly in relation to sleep-related breathing disorders. However, continuous monitoring of SaO2 is time-consuming and highly variable depending on patients' conditions. Recently, optical coherence tomography angiography (OCTA) has shown promising development in rapidly and effectively screening eye-related lesions, offering the potential for diagnosing sleep-related disorders. To bridge this gap, our paper presents three key contributions. Firstly, we propose JointViT, a novel model based on the Vision Transformer architecture, incorporating a joint loss function for supervision. Secondly, we introduce a balancing augmentation technique during data preprocessing to improve the model's performance, particularly on the long-tail distribution within the OCTA dataset. Lastly, through comprehensive experiments on the OCTA dataset, our proposed method significantly outperforms other state-of-the-art methods, achieving improvements of up to 12.28% in overall accuracy. This advancement lays the groundwork for the future utilization of OCTA in diagnosing sleep-related disorders. See project website https://steve-zeyu-zhang.github.io/JointViT
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Submitted 28 July, 2024; v1 submitted 17 April, 2024;
originally announced April 2024.
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US Microelectronics Packaging Ecosystem: Challenges and Opportunities
Authors:
Rouhan Noor,
Himanandhan Reddy Kottur,
Patrick J Craig,
Liton Kumar Biswas,
M Shafkat M Khan,
Nitin Varshney,
Hamed Dalir,
Elif Akçalı,
Bahareh Ghane Motlagh,
Charles Woychik,
Yong-Kyu Yoon,
Navid Asadizanjani
Abstract:
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate indepe…
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The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate independently designed and manufactured components using the most suitable process technology. However, adopting HI introduces design and security challenges. To enable HI, research and development of advanced packaging is crucial. The existing research raises the possible security threats in the advanced packaging supply chain, as most of the Outsourced Semiconductor Assembly and Test (OSAT) facilities/vendors are offshore. To deal with the increasing demand for semiconductors and to ensure a secure semiconductor supply chain, there are sizable efforts from the United States (US) government to bring semiconductor fabrication facilities onshore. However, the US-based advanced packaging capabilities must also be ramped up to fully realize the vision of establishing a secure, efficient, resilient semiconductor supply chain. Our effort was motivated to identify the possible bottlenecks and weak links in the advanced packaging supply chain based in the US.
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Submitted 30 October, 2023; v1 submitted 17 October, 2023;
originally announced October 2023.
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A Theoretical Perspective on Subnetwork Contributions to Adversarial Robustness
Authors:
Jovon Craig,
Josh Andle,
Theodore S. Nowak,
Salimeh Yasaei Sekeh
Abstract:
The robustness of deep neural networks (DNNs) against adversarial attacks has been studied extensively in hopes of both better understanding how deep learning models converge and in order to ensure the security of these models in safety-critical applications. Adversarial training is one approach to strengthening DNNs against adversarial attacks, and has been shown to offer a means for doing so at…
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The robustness of deep neural networks (DNNs) against adversarial attacks has been studied extensively in hopes of both better understanding how deep learning models converge and in order to ensure the security of these models in safety-critical applications. Adversarial training is one approach to strengthening DNNs against adversarial attacks, and has been shown to offer a means for doing so at the cost of applying computationally expensive training methods to the entire model. To better understand these attacks and facilitate more efficient adversarial training, in this paper we develop a novel theoretical framework that investigates how the adversarial robustness of a subnetwork contributes to the robustness of the entire network. To do so we first introduce the concept of semirobustness, which is a measure of the adversarial robustness of a subnetwork. Building on this concept, we then provide a theoretical analysis to show that if a subnetwork is semirobust and there is a sufficient dependency between it and each subsequent layer in the network, then the remaining layers are also guaranteed to be robust. We validate these findings empirically across multiple DNN architectures, datasets, and adversarial attacks. Experiments show the ability of a robust subnetwork to promote full-network robustness, and investigate the layer-wise dependencies required for this full-network robustness to be achieved.
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Submitted 7 July, 2023;
originally announced July 2023.
