Natural Language Generation and Understanding of Big Code for AI-Assisted Programming: A Review
Authors:
Man Fai Wong,
Shangxin Guo,
Ching Nam Hang,
Siu Wai Ho,
Chee Wei Tan
Abstract:
This paper provides a comprehensive review of the literature concerning the utilization of Natural Language Processing (NLP) techniques, with a particular focus on transformer-based large language models (LLMs) trained using Big Code, within the domain of AI-assisted programming tasks. LLMs, augmented with software naturalness, have played a crucial role in facilitating AI-assisted programming app…
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This paper provides a comprehensive review of the literature concerning the utilization of Natural Language Processing (NLP) techniques, with a particular focus on transformer-based large language models (LLMs) trained using Big Code, within the domain of AI-assisted programming tasks. LLMs, augmented with software naturalness, have played a crucial role in facilitating AI-assisted programming applications, including code generation, code completion, code translation, code refinement, code summarization, defect detection, and clone detection. Notable examples of such applications include the GitHub Copilot powered by OpenAI's Codex and DeepMind AlphaCode. This paper presents an overview of the major LLMs and their applications in downstream tasks related to AI-assisted programming. Furthermore, it explores the challenges and opportunities associated with incorporating NLP techniques with software naturalness in these applications, with a discussion on extending AI-assisted programming capabilities to Apple's Xcode for mobile software development. This paper also presents the challenges of and opportunities for incorporating NLP techniques with software naturalness, empowering developers with advanced coding assistance and streamlining the software development process.
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Submitted 4 July, 2023;
originally announced July 2023.
Machine-learning based methodologies for 3d x-ray measurement, characterization and optimization for buried structures in advanced ic packages
Authors:
Ramanpreet S Pahwa,
Soon Wee Ho,
Ren Qin,
Richard Chang,
Oo Zaw Min,
Wang Jie,
Vempati Srinivasa Rao,
Tin Lay Nwe,
Yanjing Yang,
Jens Timo Neumann,
Ramani Pichumani,
Thomas Gregorich
Abstract:
For over 40 years lithographic silicon scaling has driven circuit integration and performance improvement in the semiconductor industry. As silicon scaling slows down, the industry is increasingly dependent on IC package technologies to contribute to further circuit integration and performance improvements. This is a paradigm shift and requires the IC package industry to reduce the size and increa…
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For over 40 years lithographic silicon scaling has driven circuit integration and performance improvement in the semiconductor industry. As silicon scaling slows down, the industry is increasingly dependent on IC package technologies to contribute to further circuit integration and performance improvements. This is a paradigm shift and requires the IC package industry to reduce the size and increase the density of internal interconnects on a scale which has never been done before. Traditional package characterization and process optimization relies on destructive techniques such as physical cross-sections and delayering to extract data from internal package features. These destructive techniques are not practical with today's advanced packages. In this paper we will demonstrate how data acquired non-destructively with a 3D X-ray microscope can be enhanced and optimized using machine learning, and can then be used to measure, characterize and optimize the design and production of buried interconnects in advanced IC packages. Test vehicles replicating 2.5D and HBM construction were designed and fabricated, and digital data was extracted from these test vehicles using 3D X-ray and machine learning techniques. The extracted digital data was used to characterize and optimize the design and production of the interconnects and demonstrates a superior alternative to destructive physical analysis. We report an mAP of 0.96 for 3D object detection, a dice score of 0.92 for 3D segmentation, and an average of 2.1um error for 3D metrology on the test dataset. This paper is the first part of a multi-part report.
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Submitted 19 May, 2021; v1 submitted 8 March, 2021;
originally announced March 2021.
