Scalable orthogonal delay-division multiplexed OEO artificial neural network trained for TI-ADC equalization
Authors:
Andrea Zazzi,
Arka Dipta Das,
Lukas Hüssen,
Renato Negra,
Jeremy Witzens
Abstract:
We propose a new signaling scheme for on-chip optical-electrical-optical artificial neural networks that utilizes orthogonal delay-division multiplexing and pilot-tone based self-homodyne detection. This scheme offers a more efficient scaling of the optical power budget with increasing network complexity. Our simulations, based on a 220 nm SOI silicon photonics technology, suggest that the network…
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We propose a new signaling scheme for on-chip optical-electrical-optical artificial neural networks that utilizes orthogonal delay-division multiplexing and pilot-tone based self-homodyne detection. This scheme offers a more efficient scaling of the optical power budget with increasing network complexity. Our simulations, based on a 220 nm SOI silicon photonics technology, suggest that the network can support 31 x 31 neurons, with 961 links and freely programmable weights, using a single 500 mW optical comb and an SNR of 21.3 dB per neuron. Moreover, it features a low sensitivity to temperature fluctuations, ensuring that it can be operated outside of a laboratory environment. We demonstrate the network's effectiveness in nonlinear equalization tasks by training it to equalize a time-interleaved ADC architecture, achieving an ENOB over 4 over the entire 75 GHz ADC bandwidth. We anticipate that this network architecture will enable broadband and low latency nonlinear signal processing in practical settings such as ultra-broadband data converters and real-time control systems.
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Submitted 19 October, 2023; v1 submitted 10 May, 2023;
originally announced May 2023.
Graphene-based Wireless Agile Interconnects for Massive Heterogeneous Multi-chip Processors
Authors:
Sergi Abadal,
Robert Guirado,
Hamidreza Taghvaee,
Akshay Jain,
Elana Pereira de Santana,
Peter Haring Bolívar,
Mohamed Saeed,
Renato Negra,
Zhenxing Wang,
Kun-Ta Wang,
Max C. Lemme,
Joshua Klein,
Marina Zapater,
Alexandre Levisse,
David Atienza,
Davide Rossi,
Francesco Conti,
Martino Dazzi,
Geethan Karunaratne,
Irem Boybat,
Abu Sebastian
Abstract:
The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory chiplets. In such data-hungry multi-chip architectures, current Networks-in-Package (NiPs) may not be enough to cater to their heterogeneous and fast-changing communi…
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The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory chiplets. In such data-hungry multi-chip architectures, current Networks-in-Package (NiPs) may not be enough to cater to their heterogeneous and fast-changing communication demands. This position paper makes the case for wireless in-package nanonetworking as the enabler of efficient and versatile wired-wireless interconnect fabrics for massive heterogeneous processors. To that end, the use of graphene-based antennas and transceivers with unique frequency-beam reconfigurability in the terahertz band is proposed. The feasibility of such a nanonetworking vision and the main research challenges towards its realization are analyzed from the technological, communications, and computer architecture perspectives.
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Submitted 21 September, 2023; v1 submitted 8 November, 2020;
originally announced November 2020.
