SiTe CiM: Signed Ternary Computing-in-Memory for Ultra-Low Precision Deep Neural Networks
Authors:
Niharika Thakuria,
Akul Malhotra,
Sandeep K. Thirumala,
Reena Elangovan,
Anand Raghunathan,
Sumeet K. Gupta
Abstract:
Ternary Deep Neural Networks (DNN) have shown a large potential for highly energy-constrained systems by virtue of their low power operation (due to ultra-low precision) with only a mild degradation in accuracy. To enable an energy-efficient hardware substrate for such systems, we propose a compute-enabled memory design, referred to as SiTe-CiM, which features computing-in-memory (CiM) of dot prod…
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Ternary Deep Neural Networks (DNN) have shown a large potential for highly energy-constrained systems by virtue of their low power operation (due to ultra-low precision) with only a mild degradation in accuracy. To enable an energy-efficient hardware substrate for such systems, we propose a compute-enabled memory design, referred to as SiTe-CiM, which features computing-in-memory (CiM) of dot products between signed ternary (SiTe) inputs and weights. SiTe CiM is based on cross-coupling of two bit cells to enable CiM of dot products in the signed ternary regime. We explore SiTe CiM with 8T-SRAM, 3T-embedded DRAM (3T-eDRAM) and 3T-ferroelectric metal FET (FEMFET) memories. We propose two flavors of this technique, namely SiTe CiM I/II. In SiTe CiM I, we employ two additional transistors per cell for cross-coupling, achieving fast CiM operations, albeit incurring an area overhead ranging from 18% to 34% (compared to standard ternary memories). In SiTe CiM II, four extra transistors are utilized for every 16 cells in a column, thereby incurring only 6% area cost (but leading to slower CiM than SiTe CiM I). Based on the array analysis, our designs achieve up to 88% lower CiM latency and 78% CiM energy savings across various technologies considered, as compared to their respective near-memory computing counterparts. Further, we perform system level analysis by incorporating SiTe CiM I/II arrays in a ternary DNN accelerator and show up to 7X throughput boost and up to 2.5X energy reduction compared to the near-memory ternary DNN accelerators.
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Submitted 24 August, 2024;
originally announced August 2024.
STeP-CiM: Strain-enabled Ternary Precision Computation-in-Memory based on Non-Volatile 2D Piezoelectric Transistors
Authors:
Niharika Thakuria,
Reena Elangovan,
Sandeep K Thirumala,
Anand Raghunathan,
Sumeet K. Gupta
Abstract:
We propose 2D Piezoelectric FET (PeFET) based compute-enabled non-volatile memory for ternary deep neural networks (DNNs). PeFETs consist of a material with ferroelectric and piezoelectric properties coupled with Transition Metal Dichalcogenide channel. We utilize (a) ferroelectricity to store binary bits (0/1) in the form of polarization (-P/+P) and (b) polarization dependent piezoelectricity to…
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We propose 2D Piezoelectric FET (PeFET) based compute-enabled non-volatile memory for ternary deep neural networks (DNNs). PeFETs consist of a material with ferroelectric and piezoelectric properties coupled with Transition Metal Dichalcogenide channel. We utilize (a) ferroelectricity to store binary bits (0/1) in the form of polarization (-P/+P) and (b) polarization dependent piezoelectricity to read the stored state by means of strain-induced bandgap change in Transition Metal Dichalcogenide channel. The unique read mechanism of PeFETs enables us to expand the traditional association of +P (-P) with low (high) resistance states to their dual high (low) resistance depending on read voltage. Specifically, we demonstrate that +P (-P) stored in PeFETs can be dynamically configured in (a) a low (high) resistance state for positive read voltages and (b) their dual high (low) resistance states for negative read voltages, without afflicting a read disturb. Such a feature, which we name as Polarization Preserved Piezoelectric Effect Reversal with Dual Voltage Polarity (PiER), is unique to PeFETs and has not been shown in hitherto explored memories. We leverage PiER to propose a Strain-enabled Ternary Precision Computation-in-Memory (STeP-CiM) cell with capabilities of computing the scalar product of the stored weight and input, both of which are represented with signed ternary precision. Further, using multi word-line assertion of STeP-CiM cells, we achieve massively parallel computation of dot products of signed ternary inputs and weights. Our array level analysis shows 91% lower delay and improvements of 15% and 91% in energy for in-memory multiply-and-accumulate operations compared to near-memory design approaches based on SRAM and PeFET respectively. STeP-CiM exhibits upto 8.91x improvement in performance and 6.07x average improvement in energy over SRAM/PeFET based near-memory design.
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Submitted 30 March, 2022;
originally announced March 2022.
