Content deleted Content added
→Thermal paste: Fixed typo Tags: canned edit summary Mobile edit Mobile app edit Android app edit |
Tag: Reverted |
||
Line 11:
== Composition ==
The thermal paste is layer of material that is between the heatsink and the electronic component that generates the heat.
The thermal mobility the layer depends on the thickness of the layer and the the thermal conductivity of the material.
Low thickness is as important as the thermal conductivity.
To get low thickness the viscosity need to be very low, or the paste needs to be like liquid, and not a paste.
Thin layer enables to use less material.
Thus, one gram of a good material can be better than 10 grams of a material that has the same thermal quality but higher viscosity.
Thermal paste consists of a [[polymer]]izable liquid matrix and large volume fractions of electrically insulating, but thermally conductive filler. Typical matrix materials are [[epoxy|epoxies]], [[silicone]]s ([[Silicone grease]]), [[polyurethane|urethanes]], and [[Acrylate polymer|acrylates]]; solvent-based systems, hot-melt adhesives, and pressure-sensitive adhesive tapes are also available. [[Aluminum oxide]], [[boron nitride]], [[zinc oxide]], and increasingly [[aluminum nitride]] are used as fillers for these types of adhesives. The filler loading can be as high as 70–80% by mass, and raises the [[thermal conductivity]] of the base matrix from 0.17–0.3 W/(m·K) (watts per meter-kelvin)<ref>{{citation | author=Werner Haller | contribution=Adhesives | title=[[Ullmann's Encyclopedia of Industrial Chemistry]] | edition=7th | publisher=Wiley | year=2007 | pages=58–59 |display-authors=etal}}.</ref> up to about 4 W/(m·K), according to a 2008 paper.<ref>{{cite conference | url = http://www.nrel.gov/docs/fy08osti/42972.pdf | title = Thermal interface materials for power electronics applications | last1 = Narumanchi | first1 = Sreekant | last2 = Mihalic | first2 = Mark | last3 = Kelly | first3 = Kenneth | last4 = Eesley | first4 = Gary | date = 2008 | publisher = IEEE | book-title = 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008: ITHERM 2008: 28 - 31 May 2008 | at = Table 2 | doi = 10.1109/ITHERM.2008.4544297}}.</ref>
| |||