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[[File:Thermal grease.jpg|thumb|Metal (silver) thermal compound]]
[[File:Thermalgrease.jpg|thumb|Metal thermal paste applied to a chip]]
[[File:Cpuimperfections.jpg|thumb|Thermal paste is designed to fill surface imperfections on the surface of a chip.]]
'''Thermal paste''' (also called '''thermal compound''', '''thermal grease''', '''thermal interface material''' ('''TIM'''), '''thermal gel''', '''heat paste''', '''heat sink compound''', '''heat sink paste''' or '''CPU grease''') is a [[Thermal conductivity|thermally conductive]] (but usually [[Insulator (electricity)|electrically insulating]]) [[chemical compound]], which is commonly used as an interface between [[heat sink]]s and [[Heat generation in integrated circuits|heat source]]s such as high-power [[semiconductor]] devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as [[thermal insulation]]) from the interface area in order to maximize [[heat transfer]] and dissipation. Thermal paste is an example of a [[thermal interface material]].
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