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Hexamethyldisiloxane

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Hexamethyldisiloxane
Names
IUPAC name
Hexamethyldisiloxane
Other names
HMDS
HMDSO
(TMS)2O
Bis(trimethylsilyl) ether
Bis(trimethylsilyl) oxide
Identifiers
3D model (JSmol)
ECHA InfoCard 100.003.176 Edit this at Wikidata
RTECS number
  • JM9237000
  • CSi(C)(C)OSi(C)(C)C
Properties
C6H18OSi2
Molar mass 162.38 g/mol
Appearance colorless liquid
Density 0.764 g/cm3
Melting point −59 °C
Boiling point 101 °C
low
Solubility in other solvents all organic solvents
1.377
Hazards
Occupational safety and health (OHS/OSH):
Main hazards
flammable
Related compounds
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
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Hexamethyldisiloxane is a chemical compound with the formula O[Si(CH3)3]2. This volatile liquid is used as a solvent and as a reagent. The species arises by the hydrolysis of trimethylsilyl chloride. The molecule is the protypical silyl ether and can be considered a subunit of polydimethylsiloxane.

Uses

It is primarily used as source of the trimethylsilyl functional group (-Si(CH3)3) in organic synthesis. For example, in the presence of acid catalyst, it converts alcohols and carboxylic acids into the silyl ethers and silyl esters, respectively.[1]

HMDS is used as an internal standard for calibrating chemical shift in1H NMR spectroscopy. It is more easily handled since it is less volatile than the usual standard tetramethylsilane but still displays only a singlet near 0 ppm.

HMDS has even poorer solvating power than alkanes. It is therefore sometimes employed to crystallize highly lipophilic compounds.

It is also used in liquid bandages (spray on plasters) like in cavilon spray used on the body to protect damaged skin from irritation from other bodily fluids.

HMDSO is being studied for making low-k dielectric materials for the semi-conductor industries by PECVD (plasma-enhanced chemical vapor deposition).

References

  1. ^ Pfeifer, J. "Hexamethyldisiloxane" in Encyclopedia of Reagents for Organic Synthesis (Ed: L. Paquette) 2004, J. Wiley & Sons, New York. DOI: 10.1002/047084289.