Hexamethyldisiloxane
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Names | |
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IUPAC name
Hexamethyldisiloxane
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Other names
HMDS
HMDSO (TMS)2O Bis(trimethylsilyl) ether Bis(trimethylsilyl) oxide | |
Identifiers | |
3D model (JSmol)
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ECHA InfoCard | 100.003.176 |
RTECS number |
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CompTox Dashboard (EPA)
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Properties | |
C6H18OSi2 | |
Molar mass | 162.38 g/mol |
Appearance | colorless liquid |
Density | 0.764 g/cm3 |
Melting point | −59 °C |
Boiling point | 101 °C |
low | |
Solubility in other solvents | all organic solvents |
Refractive index (nD)
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1.377 |
Hazards | |
Occupational safety and health (OHS/OSH): | |
Main hazards
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flammable |
Related compounds | |
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
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Hexamethyldisiloxane is a chemical compound with the formula O[Si(CH3)3]2. This volatile liquid is used as a solvent and as a reagent. The species arises by the hydrolysis of trimethylsilyl chloride. The molecule is the protypical silyl ether and can be considered a subunit of polydimethylsiloxane.
Uses
It is primarily used as source of the trimethylsilyl functional group (-Si(CH3)3) in organic synthesis. For example, in the presence of acid catalyst, it converts alcohols and carboxylic acids into the silyl ethers and silyl esters, respectively.[1]
HMDS is used as an internal standard for calibrating chemical shift in1H NMR spectroscopy. It is more easily handled since it is less volatile than the usual standard tetramethylsilane but still displays only a singlet near 0 ppm.
HMDS has even poorer solvating power than alkanes. It is therefore sometimes employed to crystallize highly lipophilic compounds.
It is also used in liquid bandages (spray on plasters) like in cavilon spray used on the body to protect damaged skin from irritation from other bodily fluids.
HMDSO is being studied for making low-k dielectric materials for the semi-conductor industries by PECVD (plasma-enhanced chemical vapor deposition).
References
- ^ Pfeifer, J. "Hexamethyldisiloxane" in Encyclopedia of Reagents for Organic Synthesis (Ed: L. Paquette) 2004, J. Wiley & Sons, New York. DOI: 10.1002/047084289.