Bioremediation mechanism and potential of copper by actively growing fungus Trichoderma lixii CR700 isolated from electroplating wastewater

Present study investigated the Cu²⁺ removal potential of Trichoderma lixii CR700, isolated from enormously heavy metal polluted electroplating wastewater. In the batch study, actively growing CR700 was able to remove 84.6% of Cu²⁺ at the concentration 10 mg/L of Cu²⁺ within 120 h after incubation and the accumulated and surface adsorbed amount of Cu was 0.51 and 0.47 mg/g of dry biomass respectively. T. lixii CR700 also showed efficient Cu²⁺ removal potential in the pH ranges from 5.0 to 8.0, in the presence of other co-occurring contaminant such as heavy metal, anions and metabolic inhibitor as well from real tannery wastewater. Alteration on cell surface of Cu²⁺ treated mycelia of T. lixii CR700 was analyzed using scanning electron microscope. Fourier transform infrared spectroscopic analysis was performed to identify the role of surface functional group in Cu²⁺ adsorption which revealed that COO^─ functional group lead Cu²⁺ adsorption onto the surface of T. lixii CR700. Thus, T. lixii CR700 uses simultaneous surface sorption and accumulation mechanism in Cu²⁺ removal and can be potentially applied for bioremediation of Cu²⁺ contaminated wastewater in ecofriendly, safe and sustainable way.