Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth.
Lee YF, Huang YC, Chang JS, Cheng TY, Chen PY, Huang WC, Lo MH, Fu KL, Lai TL, Chang PK, Yu ZY, Liu CY.
Lee YF, et al. Among authors: lai tl.
R Soc Open Sci. 2024 Sep 11;11(9):240459. doi: 10.1098/rsos.240459. eCollection 2024 Sep.
R Soc Open Sci. 2024.
PMID: 39263455
Free PMC article.