Danny Clavette

Danny Clavette

Warwick, Rhode Island, United States
497 followers 486 connections

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University of Maine at Orono

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Bio:
Danny Clavette is a Distinguished Engineer leading a System Architecture team…

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Erleben Sie

  • Infineon Technologies Graphic

    Infineon Technologies

    Warwick, Rhode Island, United States

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    Warwick, Rhode Island, United States

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    Providence, Rhode Island Area

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    Providence, Rhode Island Area

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    Providence, Rhode Island Area

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    East Greenwich, RI

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    Masfield MA

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    Rhode Island

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    Aircraft Carriers and Various

Bildung

  • University of Maine at Orono

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    Activities and Societies: Tau-Beta-Pi Engineering Honor Society Eta-Kappa-Nu (HKN) Engineering Honor Society Autonomous Vehicle Project

    Focused on Analog IC Design.
    Student Teacher and Electronics Lab instructor
    Research Project and Grad Assistant for Folding ADC converter for Naval Undersea Warfare Center
    Interned at MITRE corporation and created a software & hardware interface of a new compute system (IBM RSC6000 series) into an existing ARTCC Air Traffic Control system.

Patents

  • Embedded substrate voltage regulators

    Issued US-11183934

  • Electronic system and interposer having an embedded power device

    Issued US11147165

  • Power module having and embedded structure

    Issued US1121708

  • Input/output pins for chip-embedded substrate

    Issued US-11101221

  • Semiconductor Module, Electronic Component and Method of Manufacturing a Semiconductor Module (HS & LS with TSV interconnect)

    Issued US-11081457

  • Multiphase Power Supply and Failure Mode Protection

    Issued US-10153697

  • Semiconductor package with integrated output inductor using conductive clips

    Issued US 10074620

  • Input/Output Pins for Chip Embedded Substrate

    Issued US 9966341

  • Package for Die-Bridge Capacitor

    Issued US 9922912

  • Package for Die bridge with integrated capacitors

    Filed US 20180068934

  • Package with Passive and Active Components

    Filed US 20180054119

  • Package with passive and active comp. integ. in pre-molded leadframe

    Issued US 9911720

  • Dual Power Converter Package

    Issued US 9799586

  • Power Converter Package with Integrated Output Inductor

    Issued US 9762137

  • Semiconductor PKG with Low Profile Switch Node Integ. Heat Spreader

    Issued US 9099452

  • Packaging of Electronic Circuitry

    Issued US 8811030

  • Packaging of electronic circuitry

    Issued USPTO 08811030

    A circuit package includes: electronic circuitry, electrically conductive material forming multiple leads, and multiple connections between the electronic circuitry and the multiple leads. A portion of the electrically conductive material associated with the multiple leads (e.g., low impedance leads supporting high current throughput) is removed to accommodate placement of the electronic circuitry. Each of the multiple leads can support high current. The multiple connections between the, the…

    A circuit package includes: electronic circuitry, electrically conductive material forming multiple leads, and multiple connections between the electronic circuitry and the multiple leads. A portion of the electrically conductive material associated with the multiple leads (e.g., low impedance leads supporting high current throughput) is removed to accommodate placement of the electronic circuitry. Each of the multiple leads can support high current. The multiple connections between the, the multiple leads provide connectivity between circuit nodes on the electronic circuitry and pads disposed on a planar surface of the electronic circuit package.

    See patent

  • Multi-Phase Buck Converter

    Issued US 7477045

  • Multi-Phase Buck Converter

    Issued US 7034511

  • Circuit and method of direct duty cycle current sharing

    US US6642631B1

  • Circuit connectivity and conveyance of power status information

    US US20160154037A1

  • Drive enhancement in switch driver circuitry

    US US9172306B2

  • Dual Power Converter Package Using External Driver IC

    US US20130256859A1

  • Embedding into printed circuit board with drilling

    US-10206286

  • Flip chip HS FET die on chip-embedded LS FET die

    US 2019E51396

  • Headroom compensation circuit for voltage converter

    US US7960957B2

  • Integrated Dual Power Converter Package Having Internal Driver IC

    US US20130256807A1

  • Method and App. for Zero Current Switching in Sw Cap Converters

    US-10122256

  • Method and apparatus for adjusting current amongst phases of a multi-phase converter

    US US6912144B1

  • Method and apparatus for calibrating a ramp signal

    US US20060043956A1

  • Method and apparatus for customizing of a power supply based on load characteristic data

    US US20060043947A1

  • Monolithic Power Converter Package

    US US20130257524A1

  • Monolithic Power Converter Package with Through Substrate Vias

    US US20130256905A1

  • Multi-phase buck converter

    US 6806689B2

    See patent

  • Packaging of electronic circuitry

    US 8786068

  • Power Converter Package with Integrated Output Inductor

    US US20160104665A1

  • Power semiconductor package having power semiconductor die in a support substrate with bar vias

    US US9640474B1

  • Power supply control and use of generated ramp signal to control activation

    US-10298123

  • Power switch packaging with pre-formed electrical connections for connecting inductor to one or more transistors

    US US9911720B1

  • Powerstage attached to inductor

    US US20180054119A1

  • Semiconductor Package with Integrated Output Inductor Using Conductive Clips

    US US20160286656A1

  • Semiconductor Package with Low Profile Switch Node Integrated Heat Spreader

    US US20150130036A1

  • Semiconductor package with embedded output inductor

    US US9831159B2

  • Turbo circuit for providing voltage regulation and related method

    US US20110248692

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