Hesse Mechatronics, Inc.

Hesse Mechatronics, Inc.

Semiconductors

Tustin, CA 801 followers

Wedge, Ribbon and Ball Bonders and Smart Welders

Über uns

Hesse Mechatronics, Inc. (formerly Hesse & Knipps, Inc.) is the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for backend semiconductor assembly in the power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics industries. The company designs and manufactures high speed, fully automatic fine pitch thin wire bonders for aluminum and gold round wire and ribbon, and heavy wire bonders for aluminum, gold and copper round wire and ribbon, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages. In addition to the most advanced wire bonding equipment, Hesse Mecharonics, Inc. also provides wire bonding equipment training, applications support, development and production of wire bonding prototypes and pre-production manufacturing in four applications and demonstration labs throughout the USA.

Website
http://www.hesse-mechatronics.com
Industrie
Semiconductors
Größe des Unternehmens
11-50 Mitarbeiter
Hauptsitz
Tustin, CA
Typ
In Privatbesitz
Spezialitäten
thin wire wedge bonders, wedge bonders, heavy wire wedge bonders, ribbon bonders, wire bonding equipment training, wedge bonding process support, wire bonding application development, pre-production manufacturing, and wire bonding prototypes

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Employees at Hesse Mechatronics, Inc.

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