Demand for higher reliability requires more advanced and historically slow equipment and methodologies, but improvements are on the way. By Gregory Haley. https://lnkd.in/eXFm6NGK Part 2 of a roundtable, discussing metrology at the most advanced nodes and the impact of using different substrates, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; John R Hoffman, computer vision engineering manager at Nordson TEST & INSPECTION & Measurement; and Jiangtao Hu, senior technology director at Onto Innovation. (Part 1 can be found here https://lnkd.in/eMy-4G36 ) #semiconductor #metrology #glasssubstrates #semiconductormetrology
Semiconductor Engineering
Online Audio and Video Media
Silicon Valley, CA 83,661 followers
Deep insights for the tech industry
About us
Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations and standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors, as well as insights into the market dynamics that make it all possible. The goal of this site is to provide useful, independently developed content through targeted monthly newsletters, weekly updates, timely news alerts, videos, independent research, and a portal that serves as a forum for exchanging ideas and answering questions.
- Website
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http://semiengineering.com
External link for Semiconductor Engineering
- Industry
- Online Audio and Video Media
- Company size
- 2-10 employees
- Headquarters
- Silicon Valley, CA
- Type
- Self-Owned
- Founded
- 2013
Locations
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Primary
Silicon Valley, CA, US
Employees at Semiconductor Engineering
Updates
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Promises And Pitfalls Of SoC Restructuring https://lnkd.in/gTTdvr4f Sidestepping data incompatibility issues in heterogeneous chip designs. As chips become more complex and increasingly heterogeneous, it’s becoming more difficult to keep track of different methodologies, tools, and blend data from different sources to create a chip. Tim Schneider, staff application engineer at Arteris, explains why IP-XACT has become so critical, why it took so long to gain a solid foothold in chip design, and how the new IP-XACT standard interfaces with SystemVerilog. #chipdesign #semiconductor #IPXACT #SystemVerilog #heterogeneousintegration Tim S. Arteris
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SemiEngineering's latest newsletters. https://lnkd.in/gBSmeftb 5 channels: -Manufacturing, Packaging and Materials -Low Power, High Performance -Systems and Design -Test, Measurement and Analytics -Automotive, Security and Pervasive Subscribe here (right side box) #semiconductor #semiconductormanufacturing #EDA #chipdesign #lowpower #advancedpackaging #automotiveelectronics #HardwareSecurity #highperformancecomputing #dataanalytics #semiconductortest
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Early news roundup this week: https://lnkd.in/gs2NHGxP Sk Hynix’s bets big on HBM; GF’s purchase; Altair acquires EDA company; high-performing, low-power LLM without matrix multiplication; US Tech Hubs funding; Renesas-Altium deal passes key test; workforce drive; imec’s CMOS 2.0. 3D interconnect and backside technologies and more... #semiconductor #EDA #HBM #LLMs #acquisitions SK hynix GlobalFoundries Rogue Valley Microdevices, Inc. SILICON BOX SEMI Cadence Design Systems Google Renesas Electronics Altair Natcast.org Purdue University College of Engineering Purdue University Eindhoven University of Technology KU Leuven Mixel, Inc. Flex Logix Technologies, Inc. stiftung neue verantwortung University of California, Santa Cruz Rui-Jie Zhu, Yu Zhang, Ethan Sifferman Julien Ryckaert Christina Rupp ASML Metrics Design Automation Cadence Design Systems
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Security Focus Widens To HW, SW, Ecosystems: https://lnkd.in/gVTFYYPu Change reflects higher value of data and push to more heterogeneous designs. By Ann Mutschler. #cybersecurity #HardwareSecurity #semiconductor #softwaresecurity Cycuity Infineon Technologies Intel Corporation Rambus TXOne Networks Siemens Digital Industries Software Synopsys Inc Vivek Tiwari Dana Neustadter Neeraj Paliwal Andreas Kuehlmann Josef Haid Lee Harrison Jim Montgomery Victoria Coleman United States Air Force
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Verification Tools Straining To Keep Up: https://lnkd.in/g4AbbNhv Verification engineers are the unsung heroes of the semiconductor industry, but they are at a breaking point and desperately in need of modern tools and flows to deal with the rapidly increasing pressures. By Brian Bailey. #EDA #verification #semiconductor #UVM #portablestimulus Ashish Darbari Axiomise Chris Mueth Keysight Technologies Marc Swinnen Ansys Arturo Salz Synopsys Inc Gabriel Pachiana Fraunhofer IIS, Division Engineering of Adaptive Systems EAS Tom Fitzpatrick Siemens EDA (Siemens Digital Industries Software) Matt Graham Cadence Design Systems
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Data abstractions are a necessary part of enabling shift left, extend right, and stretch sideways, but that data must be carefully managed. By Brian Bailey. https://lnkd.in/ghZ7nAAX #EDA #verification #shiftleft #semiconductor Chris Mueth Keysight Technologies Ansys Lang Lin Insaf Meliane Arteris Frank Schirrmeister Synopsys Inc Matt Graham Cadence Design Systems Marc Swinnen Simon Rance
Data Coherence Across Silos And Hierarchy
https://semiengineering.com
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New technical papers recently added to Semiconductor Engineering’s library. https://lnkd.in/gwg5EMVC #semiconductor #interconnects #plasmaetch #IRdrop #SiC #NVM #quantum #photonics imecKU Leuven University of Maryland IBM Arkema Intel Corporation Lam Research UCLA National Tsing Hua University, National Taiwan University MediaTek University of Cambridge, University of Warwick, Chongqing University SpaceX Ruhr University Bochum of University of Duisburg-Essen Niels Bohr Institute, University of Copenhagen, University of Bristol, Aalto University Jean-Philippe Soulié Kiroubanand SANKARAN Benoit Van Troeye Gottlieb Oehrlein, Robert Bruce Keren Kanarik Ameer Janabi Luke Shillaber Felix Staudigl, Dr.-Ing. Jan Philipp Thoma Christian Niesler, Lingyun Y., Martin Trapp, Jelin Leslin Edward Deacon
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SemiEngineering's latest Manufacturing, Packaging and Materials Newsletter https://lnkd.in/ggnB_-dQ #semiconductor #semiconductormanufacturing #EUV #CMP #ruthenium #GPU #advancedpackaging #DRAM ASE Global United Microelectronics Corporation (UMC) Lam Research Brewer Science Promex Industries Inc. QP Technologies Amkor Technology, Inc. Synopsys Inc Tignis D2S, Inc.
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Top news this week: https://lnkd.in/gkSv38DZ DAC; CHIPS funding; CXL standards; Nexperia investment; US curbs tech investments; Accellera’s Federated Simulation Group; European sustainability concerns; SIA’s tracking tool; Multibeam’s multicolumn litho system; controlling warpage in advanced packages; digital twins and more. #semiconductor #semiconductormanufacturing #lithography Design and Automation Services Tenstorrent Intel Corporation Sarita Adve Alan Lee Julia Christina Hess stiftung neue verantwortung Entegris Semiconductor Industry Association JEDEC Accellera Systems Initiative Synopsys Inc Cadence Design Systems Siemens Digital Industries Software Ansys CEA-Leti Nexperia Axcelis Technologies Broadcom EtchedAxelera AI Shams Tarek Dipayan Saha University of Florida Geoff Twardokus Hanif Rahbari Brian Huchel Purdue University SEMI Multibeam Corporation proteanTecs Lam Research Infineon Technologies Oak Ridge National Laboratory Nora Dianne Bull Ezell University of Duisburg-Essen Karin Everschor-Sitte
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