Alphawave Semi

Alphawave Semi Completes Tape-Out of Multi-Protocol I/O Connectivity Chiplet for HPC and AI! We’ve successfully taped out the first-ever multi-protocol I/O connectivity #chiplet designed for high-performance computing (HPC) and AI infrastructure. This breakthrough chiplet is set to revolutionize the next generation of data centers and AI systems, offering unmatched flexibility and scalability. As the demand for faster, more efficient data processing continues to soar, our cutting-edge technology is ready to power the future of #HPC and #AI. We’re proud to be leading the charge in shaping the future of HPC and AI with innovative solutions. https://lnkd.in/eJeip2As #AlphawaveSemi #ConnectivityIP #ConnectivitySolutions #Chiplets #AI #Connectivity #CustomSilicon #Silicon

PCIe Over Optical: Transforming High-Speed Data Transmission! With the rise of #AI requiring new computing models and enhanced data transmission methods to cope, the necessity for innovative, high-performance, and low-latency connectivity solutions has never been more apparent. #PCIe over Optical is set to play a key role in enabling the growth of AI. In our latest blog, we examine some of the intricacies of PCIe over Optical, exploring its implementation, challenges, and potential. Check out the full blog here: https://lnkd.in/ekdd48TH #AlphawaveSemi #ConnectivityIP #ConnectivitySolutions #Chiplets #AI #Connectivity #CustomSilicon #Silicon

Alphawave Semi announces its CTO, Dr. Tony Chan Carusone, will deliver a keynote address on #chiplets and connectivity for #AI systems to the IEEE Hot Interconnects symposium. Taking place from August 21-23, the event will explore how expanding AI models demand #GPU networks that extend beyond the rack. This raises the question: How can optical interconnects be engineered to transmit over tens of meters at 10Tb/s, with data transfer rates doubling every two years? On August 21 at 1 p.m. PDST (4 p.m. Eastern, 10 p.m. CEST), Dr. Tony Chan Carusone will present 'Connectivity for AI Everywhere: The Role of Chiplets.' He will discuss how chiplet-based architectures are helping companies reduce costs and time-to-market by meeting the accelerated demands of AI infrastructure, focusing on inter-die communication and high-speed optical connectivity. To find out more, visit: https://lnkd.in/eyyuQdnr #AlphawaveSemi #ConnectivityIP #ConnectivitySolutions #Chiplets #AI #Connectivity #CustomSilicon #Silicon

Thank you for visiting us at FMS: the Future of Memory and Storage where we showcased our latest #PCIe and #CXL solutions. At the event, we demonstrated a live PCIe 6.0 link, utilizing the VIAVI Xgig® 6P4 Exerciser platform and Alphawave Semi's PipeCORE64™ subsystem IP. Learn more: https://ow.ly/J5IY50T0W8K

Only 10 Days to go for Hot Interconnects 2024 - secure your spot now! 🎟️ Free registration is still open: 🔗 https://lnkd.in/grVxbnNj   We’re honored to have Tony Chan Carusone, CTO at Alphawave Semi, delivering a keynote on “Connectivity for AI Everywhere: The Role of Chiplets.” This is a pivotal session for anyone invested in the future of AI and chiplet technology.   Abstract: Chiplet technology is set to be a transformational paradigm. It offers compelling advantages in cost, time-to-market, and power consumption. AI has emerged as a primary catalyst for this trend because the only way to meet the accelerated demands of AI is by using chiplets. By combining dense logic, memory, and high-speed connectivity chiplets, new silicon systems tailored to specific workloads can be created without starting from scratch each time. As chiplet adoption increases, so do the bandwidth demands both within the package across die-to-die interfaces, and beyond the package. Low-latency inter-die communication is crucial for compute performance, and high-speed optical interconnects are vital for scaling AI clusters.   Don’t miss this chance to connect with industry leaders and expand your professional network. Time is running out—register today and be part of Hot Interconnects 2024. We can’t wait to see you there! #hoti #hoti24 #hpc #datacenter #interconnection #smartnic #fpga #conference2024

The semiconductor industry is shifting as floor planning adapts to the #chiplet era. Traditional monolithic designs are being replaced by a modular approach, where multiple smaller chips, or #chiplets, are integrated into a single package. A recent article in Semiconductor Engineering explores the challenges and opportunities of this transition. Our CTO, Tony Chan Carusone, weighed in on how the shift to a chiplet design paradigm will impact modern place-and-route design flows, emphasizing the need to optimize logical partitions among chiplets. While the chiplet approach opens new possibilities, it also requires rethinking traditional design processes to fully harness its potential. To learn more about how floor planning is evolving with the chiplet revolution, check out the full article: https://lnkd.in/g97PWxCS #AlphawaveSemi #ConnectivityIP #ConnectivitySolutions #Chiplets #AI #Connectivity #CustomSilicon #Silicon

To GPU or Not GPU: Is That the Question? Our CTO, Tony Chan Carusone, joined a panel during DatacenterDynamics #AI Week to explore this very question! Tony, alongside Sebastian Moss, Jon Summers and Karl Freund, discussed AI's undeniable impact on the world and whether we truly understand the hardware behind these advanced workloads. While GPUs offer flexibility and meet general computing needs, can they maintain their foothold? The discussion covered several key topics, including why we use GPUs, the ongoing #GPU power struggle who is leading the pack, and what other options are available for accelerators. They also talked about the emergence of specialized processors and how we should think differently about inference. Watch the full panel here: https://lnkd.in/e4WgDPKf #AlphawaveSemi #ConnectivityIP #ConnectivitySolutions #Chiplets #AI #Connectivity #CustomSilicon #Silicon

Last week, we attended the FMS: the Future of Memory and Storage event, partnering with VIAVI Solutions. We showcased our latest #PCIe innovations, designed to drive the future of high-performance computing. Our team demonstrated how our cutting-edge solutions are pushing the boundaries of what's possible in the industry. Additionally, David Kulansky delivered a presentation on 'High-Performance Disaggregated Systems through #UCIe Interconnects and #Chiplets,' exploring the next generation of computing and showcasing how our technology is at the forefront. If you missed us, you can learn more about our PCle innovations here: https://lnkd.in/eNPE4Bsr #AlphawaveSemi #ConnectivityIP #ConnectivitySolutions #Chiplets #AI #Connectivity #CustomSilicon #Silicon

From Simulation to Silicon: Alphawave & Keysight’s #UCIe Validation at DAC 2024! Check out this video where Letizia Giuliano discusses UCIe compliance validation and demonstrates the complete journey to achieve #UCIe compliance. She examines each step, from the initial silicon design to the system simulation phase. By taking a holistic approach, Letizia highlights the processes and key checkpoints necessary for successful validation. Don’t miss this informative exploration of cutting-edge technology! https://lnkd.in/e3KJWU_D #AlphawaveSemi #ConnectivityIP #ConnectivitySolutions #Chiplets #AI #Connectivity #CustomSilicon #Silicon #UCle #DAC2024

Alphawave Semi: Advancing the Open Chiplet Ecosystem with UCIe 2.0, and Launching the Industry’s First 3nm 24G UCIe IP with TSMC CoWoS Advanced Packaging. We are excited to announce that #UCIe 2.0 is propelling the open #chiplet ecosystem forward with groundbreaking advancements. The latest specification enhances support for 3D packaging and manageability system architecture, ensuring a robust and versatile platform. UCIe 2.0 also delivers higher bandwidth density and improved power efficiencies, all while maintaining full backward compatibility with UCIe 1.1 and UCIe 1.0 specifications. In line with Alphawave Semi commitment to driving innovation, we are proud to launch the industry’s first 3nm 24G UCIe IP with TSMC CoWoS advanced packaging. This cutting-edge IP underscores our leadership in the industry to target high-performance computing (#HPC) and artificial intelligence (#AI) applications, offering unprecedented performance and efficiency. Read more here: https://lnkd.in/ear3K4-8 #Innovation #Semiconductors #AlphawaveSemi #TSMC #HighPerformanceComputing #AI #Technology #UCIe #Chiplet #TSMC #CoWoS