Siemens EDA (Siemens Digital Industries Software)

Join Siemens EDA and be part of our innovative team driving the future of electronic design automation. We’re looking for talented professionals passionate about cutting-edge technology and making a difference. Explore opportunities and apply today! https://sie.ag/5A7eU7

“Assembly verification flow for silicon interposers with embedded deep trench capacitance,” Suvarna Vikhankar of Broadcom discusses advanced verification processes. Learn how Broadcom and Siemens tackle multi-die strategies and eDTC challenges. Watch now on-demand! https://sie.ag/2rkUkR

Design reuse faces hurdles like lack of traceability and inconsistent practices. Creating a unified central library and standardized procedures can overcome these. Embracing design reuse boosts efficiency, reduces development cycles, and enhances project outcomes. Read the full article here: https://sie.ag/7WmJS7

Even minor process variations can significantly impact yield and time-to-market. This is where Tessent Hi-Res Chain software can help, designed to address the critical challenges faced by integrated circuit (IC) design and manufacturing teams in advanced technology nodes. "Tessent Hi-Res Chain represents a major leap forward in our ability to rapidly identify and address yield-limiting factors in advanced IC designs," said Ankur Gupta, vice president and general manager of the Digital Design Creation Platform division, Siemens Digital Industries Software. "By providing unprecedented accuracy and resolution in defect isolation, we're empowering our customers to accelerate their yield ramp and improve time-to-market for cutting-edge semiconductor products." Read the full news story coverage via the link in our comments!

Siemens is at the forefront of innovation once again, bringing advanced multiphysics and AI to chip design! A recent Forbes article highlights our groundbreaking work in integrating these cutting-edge technologies, enabling designers to tackle the most complex challenges in semiconductor design. By leveraging multiphysics simulations and AI-driven methodologies, we're not only enhancing performance but also driving efficiency and reliability in chip design. Read the full article to learn how Siemens is revolutionizing the future of chip design: https://sie.ag/7LKvEq

Our SAFE™ Forum, held June 13th in San Jose, brings partners together in an effort to build a strong foundry #ecosystem. One such partner is Mike Ellow, CEO of Siemens EDA (Siemens Digital Industries Software), who spoke about “Enabling a New Era of Design.” Thanks to Mike and all the other partners who participated in the event and who continuously work to accelerate innovation beyond boundaries.   Check out our interview with Mike to see what he had to say about the SAFE™ Forum, the partnership between Siemens and Samsung, and more. Click here to read more about this year's event: https://lnkd.in/gUeAnan6    #SamsungFoundry #AI Design with Calibre Tessent Silicon Lifecycle Solutions Siemens Digital Industries Software Custom IC Verification Solutions (Siemens EDA)

A huge thank you to all the incredible attendees who made our first Ideation Event at Silicon Crossroads a #success! Your support is what makes our hub thrive. Catch a #recap of the event's highlights below and see the #innovation and #collaboration in action! David Roberts Brooke Pyne Andrew Kossack Leslie Wolfe William Kiser Brett Hamilton Jalen Rollins Michael Bilyeu Courtney Baker Mitch Hobson, M.Ed. Matt Burkett Caleb Frady Amanda-Lynn Porta Travis Hayes

🎉 Thank You for an Amazing #DAC! 🎉 As #61DAC wraps up, we want to extend a heartfelt thank you to all our customers and partners who visited the Siemens booth. Your enthusiasm for our latest solutions in semiconductor design and verification made this event truly special! Enjoy the final day of conferences and exhibitions, and let's keep the momentum going. Together, we will continue to push the boundaries of innovation in chip design! 

#DYK that our ongoing collaboration with Intel Foundry has established a new Electronic Design Automation (EDA) product certification, as well as an embedded multi-die interconnect bridge (EMIB) enablement breakthrough that can help mutual customers take advantage of the performance, space and power efficiency advantages of 3D integrated circuit (3D-IC) designs much more quickly. Together we recently certified Siemens' new Solido SPICE, part of Solido Simulation Suite software for the foundry’s Intel 16 and Intel 18A nodes. An advanced portfolio of AI-accelerated simulators for intelligent IC design and verification, the new Solido Simulation Suite provides leading-edge, feature-rich circuit verification for analog, mixed-signal, RF, memory, library IP, 3D-IC and System-on-a-chip (SoC) design. Intel 18A represents the latest advancement in Intel Foundry’s process technology roadmap, featuring advanced RibbonFET gate-all-around (GAA) transistor architecture and PowerVia backside power delivery technologies to help customers optimize the density and performance of their next-generation products. Intel 18A is ideal for IC designs targeting high growth applications including the High-Performance Computing (HPC), mobile and other demanding and fast-growing applications. Intel 18A and Intel 16 are also now enabled with Open Model Interface (OMI), the industry-standard platform for enabling aging modeling and reliability analyses, supported by Siemens’ Solido Simulation Suite. “Siemens is committed to collaborating with Intel Foundry to provide our mutual customers with the most advanced technologies possible to leverage when designing highly complex ICs and advanced packaging,” said Amit Gupta, our VP and general manager, Custom IC Verification. “The certification of Solido SPICE and the availability of the EMIB reference flow for early customers by Intel reinforce our joint commitment to providing mutual customers with highly accurate, next-generation tools that enable innovation required to differentiate and win in highly competitive markets.” “Intel Foundry is revitalizing the semiconductor industry with new fabrication and highly innovative advanced packaging technologies targeted at taking modern day electronics to entirely new levels. Our collaboration with Siemens for precise EDA enablement is key to nurturing the growing ecosystem” said Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry. “The recent certification of Siemens’ newly released Solido SPICE, part of Solido Simulation Suite, to run seamlessly on our advanced process technologies underscores the success we’ve seen in our ongoing close collaboration with Siemens. And by developing a certified, production ready EMIB technology reference flow, Intel Foundry and Siemens EDA have delivered yet another major milestone, empowering IC design companies to boldly innovate complex ICs for any electronic application.” https://sie.ag/5DBpsW #EDA #Certification #EMIB

Join Us for a Cocktail Reception at #DAC! You're invited to a special cocktail reception at our Siemens booth during DAC 2024! 🗓️ Date: June 25th, 2024 🕔 Time: 5:00 PST 📍 Location: Siemens Booth #2521, Level 2, Moscone West Convention Center Come mingle with industry experts, enjoy delicious drinks, and discover our latest innovations in semiconductor design and verification. Don’t miss this opportunity to network and unwind with fellow professionals! We look forward to seeing you there!